EP3C40F484I7

The EP3C40F484I7 is a Cyclone III family FPGA offering a balance of high functionality and low-power operation for cost-sensitive, high-volume designs. Built on the Cyclone III architecture, this device provides a sizable logic fabric, embedded memory, and a robust I/O count suited to a wide range of embedded and industrial applications.

Key device metrics include 39,600 logic elements, approximately 1.16 Mbits of embedded memory, and 331 user I/Os in a 484-FBGA (23×23) package. The device is specified for industrial operation (–40 °C to 100 °C) and supports a core voltage supply range of 1.15 V to 1.25 V.

Key Features

• Logic Capacity  39,600 logic elements provide substantial combinational and sequential resources for custom logic, control, and glue-logic implementations.
• Embedded Memory  Approximately 1.16 Mbits of on-chip RAM to support FIFOs, buffers, and small data storage without external memory.
• I/O Count & Flexibility  331 user I/Os accommodate complex interfacing and board-level connectivity; Cyclone III family devices support a wide range of common I/O standards to simplify system integration.
• Clock Management  Family-level features include multiple phase-locked loops (PLLs) for robust clock synthesis and distribution across the design.
• Low-Power Architecture  Cyclone III devices are designed for low static power consumption through process and silicon optimizations, helping reduce thermal management and extend battery life in portable designs.
• Package  484-FBGA (23×23) package offers high pin density in a compact form factor suitable for space-constrained PCBs.
• Industrial Operating Range  Specified for –40 °C to 100 °C operation, making it suitable for industrial environments.
• Supply & Compliance  Core supply range of 1.15 V to 1.25 V; RoHS compliant.

Typical Applications

• Industrial Control  Implement motor control, protocol bridging, and deterministic I/O handling using the device’s logic capacity and industrial temperature range.
• Communications Infrastructure  Use as a protocol adapter, packet formatter, or timing management element where high I/O density and on-chip memory accelerate board-level integration.
• Consumer & Portable Electronics  Low-power characteristics and embedded memory enable feature-rich, energy-efficient designs for handheld and battery-powered products.
• Video and Imaging Pre-Processing  Leverage the FPGA fabric and RAM for data buffering, preprocessing, and interface bridging in imaging pipelines.

Unique Advantages

• Substantial Logic and Memory in a Single Device:  39,600 logic elements and ~1.16 Mbits of on-chip RAM reduce the need for external glue logic and small memories, simplifying BOM and PCB layout.
• High I/O Density:  331 user I/Os enable multiple parallel interfaces and board-level consolidation, helping to minimize external bridge components.
• Industrial Temperature Rating:  Rated from –40 °C to 100 °C to address thermally demanding and outdoor installations.
• Compact, High-Density Package:  484-FBGA (23×23) provides high pin count in a compact footprint for space-constrained designs.
• Power-Efficient Platform:  Cyclone III family design and low-power process optimizations help lower static power consumption and thermal load.
• Proven Family Ecosystem:  As part of the Cyclone III family, the device benefits from established device features and a library of pre-built IP cores for common functions.

Why Choose EP3C40F484I7?

The EP3C40F484I7 delivers a practical combination of logic density, embedded memory, and I/O capacity in a low-power Cyclone III FPGA tailored for industrial and cost-sensitive applications. Its industrial temperature rating and compact 484-FBGA package make it a strong choice for designs that require reliable operation across temperature extremes and dense board-level integration.

Designers seeking a scalable, power-conscious FPGA platform will find the EP3C40F484I7 suitable for a range of functions—from protocol bridging and control logic to preprocessing and interface consolidation—while leveraging the Cyclone III family’s ecosystem and IP resources.

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