EP3C40F484C7

The EP3C40F484C7 is an Intel Cyclone® III field programmable gate array (FPGA) provided in a 484‑ball fine‑pitch BGA package. It combines a mid‑range logic fabric with embedded memory and a high I/O count targeted at high‑volume, low‑power, cost‑sensitive applications.

As a Cyclone III device, it is based on a low‑power semiconductor process and is optimized for low static power consumption while providing integration for system‑level functions and flexible I/O support.

Key Features

• Logic Capacity — 39,600 logic elements driven by 2,475 configurable logic blocks (CLBs) for implementing custom digital functions and state machines.
• Embedded Memory — Approximately 1.16 Mbits of on‑chip RAM to support buffering, FIFOs, and small data stores without external memory.
• I/O Density — 331 user I/Os to interface with multiple peripherals, sensors, and high‑pin‑count boards.
• Power and Voltage — Operates from a core supply range of 1.15 V to 1.25 V; Cyclone III family optimizations target low static power consumption (family note: less than ¼ watt static power).
• Clocking and System Integration — Cyclone III architecture provides integrated PLLs and system‑level features for clock management and embedded processing support at the family level.
• Package and Mounting — 484‑FBGA (23 × 23) package, surface‑mount mounting type, suited for compact PCB implementations.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for commercial applications.
• RoHS Compliant — Meets RoHS environmental requirements for lead‑free assembly.

Typical Applications

• Portable and Handheld Electronics — Low‑power Cyclone III architecture helps extend battery life in compact systems that require programmable logic and on‑chip memory.
• Consumer and High‑Volume Products — Mid‑range logic capacity and cost‑oriented family characteristics make the device appropriate for high‑volume, cost‑sensitive designs.
• Embedded Control and Signal Processing — On‑chip RAM and the Cyclone III device features support control logic, buffering, and modest signal processing tasks.
• I/O‑Rich Interface Modules — 331 I/Os accommodate multi‑channel sensor interfaces, display controllers, and board‑level glue logic.

Unique Advantages

• Balanced Logic and Memory: 39,600 logic elements alongside approximately 1.16 Mbits of embedded memory reduce reliance on external components for many mid‑range designs.
• High I/O Count: 331 user I/Os enable flexible connectivity and simplify board routing for feature‑rich products.
• Low‑Power Family Design: Based on a low‑power process with core operation at 1.15–1.25 V, the Cyclone III family targets reduced static power for energy‑sensitive applications.
• Compact, Assembly‑Ready Package: 484‑FBGA (23×23) surface‑mount package supports high‑density PCB layouts in space‑constrained systems.
• Commercial Temperature Suitability: Rated 0 °C to 85 °C, appropriate for standard commercial electronics environments.
• Regulatory Compliance: RoHS compliance supports modern environmental and manufacturing requirements.

Why Choose EP3C40F484C7?

The EP3C40F484C7 places mid‑range FPGA resources into a compact, low‑power package ideal for designers who need a balance of logic capacity, embedded memory, and abundant I/O without the overhead of higher‑end devices. Its Cyclone III heritage brings device‑level optimizations for low static power and system integration features that suit high‑volume, cost‑sensitive products.

This device is well suited to teams developing portable, consumer, and embedded systems that require programmable logic, on‑chip memory, and strong I/O flexibility while maintaining commercial temperature operation and RoHS compliance.

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