EP3C40F324I7N

The EP3C40F324I7N is an Intel Cyclone® III FPGA packaged in a 324-ball BGA, built for low-power, high-functionality logic integration. It combines 39,600 logic elements, approximately 1.16 Mbits of embedded memory, and 195 I/Os to address mid-range, I/O‑constrained designs in industrial and portable applications.

Designed on a low-power process and intended for surface-mount assembly, this industrial‑grade device supports supply voltages from 1.15 V to 1.25 V and an operating range of −40 °C to 100 °C, making it suitable for thermally and environmentally demanding systems.

Key Features

• Logic Capacity  39,600 logic elements organized across 2,475 CLBs provide substantial programmable fabric for control, signal processing, and interface logic.
• Embedded Memory  Approximately 1.16 Mbits of on-chip RAM to support buffering, FIFOs, and local storage without external memory in many use cases.
• High I/O Count  195 user I/Os to accommodate multiple parallel interfaces, sensors, and peripheral connections.
• Low-Power Process  Built on a low-power process technology to optimize static and dynamic power for battery‑sensitive and thermally constrained applications.
• Clock Management  Cyclone III family clocking features (including multiple PLLs) enable flexible clock synthesis and distribution for complex timing architectures.
• Package and Mounting  324-BGA (324-FBGA, 19×19) package in a surface-mount form factor for dense PCB layouts and automated assembly.
• Industrial Temperature and Supply  Rated for −40 °C to 100 °C operation with supply voltage range of 1.15 V to 1.25 V for reliable performance across environments.
• Compliance  RoHS‑compliant construction to meet modern environmental directives.

Typical Applications

• Industrial Control  Deterministic logic, interface bridging, and local processing for factory automation and instrumentation where extended temperature range and robustness are required.
• Communications and Networking  Protocol conversion, packet processing assist, and custom PHY interface logic leveraging the device’s high I/O count and programmable fabric.
• Portable and Handheld Devices  Low-power operation and on-chip memory make it suitable for battery‑sensitive or thermally constrained portable systems that need custom logic.
• Embedded Systems and Prototyping  Custom peripherals, hardware acceleration, and system glue logic for embedded designs that benefit from reprogrammability and pre‑built IP support.

Unique Advantages

• Significant Logic Resources: 39,600 logic elements and 2,475 CLBs provide the capacity to implement complex state machines, parallel datapaths, and custom accelerators.
• On-Chip Memory: Approximately 1.16 Mbits of embedded RAM reduces dependency on external memory and simplifies board-level BOMs.
• Flexible I/O: 195 I/Os allow direct interfacing to multiple sensors, buses, and peripherals without additional interface chips.
• Industrial Reliability: Rated for −40 °C to 100 °C and supplied in a robust FBGA package suited for industrial environments.
• Low-Voltage Operation: Narrow supply range (1.15 V–1.25 V) supports power‑optimized designs and consistent device behavior across operating conditions.
• RoHS Compliant: Environmentally compliant manufacturing and materials for modern product lifecycles.

Why Choose EP3C40F324I7N?

The EP3C40F324I7N balances substantial programmable logic, embedded memory, and a high I/O count within a compact 324‑BGA package, positioned for mid-range designs that require configurable hardware with industrial operating range. Its low-power process origins and family clocking and IP support enable designers to optimize power, integration, and system performance without over‑specifying silicon.

This device is a practical choice for engineers building industrial controllers, communications interfaces, portable systems, and embedded platforms where reprogrammability, on-chip resources, and environmental resilience deliver long‑term design flexibility.

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