EP3C40F324I7

The EP3C40F324I7 is an Intel Cyclone® III family FPGA providing 39,600 logic elements in a low-power, highly integrated programmable fabric. Designed for industrial applications, the device combines a substantial I/O complement with on-chip embedded memory and flexible clock-management capabilities suitable for cost- and power-sensitive designs.

As a member of the Cyclone III device family, this FPGA targets high-volume, low-power applications that require significant logic density, multiple I/Os, and embedded memory while operating across an extended industrial temperature range.

Key Features

• Logic Fabric  39,600 logic elements provide the programmable resources for complex custom logic and signal processing functions.
• Embedded Memory  Approximately 1.16 Mbits of on-chip RAM for buffers, FIFOs, and embedded data storage.
• I/O Capacity  195 user I/Os to support multiple interfaces and board-level connectivity requirements.
• Low-Power Family Characteristics  Based on the Cyclone III family low-power device characteristics, optimized for reduced static power consumption suitable for battery-powered and thermally constrained systems.
• Clock Management  Cyclone III family devices include on-chip PLL resources for flexible clock synthesis and distribution (family-level feature).
• Package and Mounting  324-ball FBGA package (19×19) in a 324-BGA case, designed for surface-mount PCB assembly.
• Supply Voltage  Core supply range of 1.15 V to 1.25 V, enabling standard low-voltage FPGA core operation.
• Industrial Temperature Range  Qualified for operation from −40 °C to 100 °C, supporting industrial-environment deployments.
• Standards and Compliance  RoHS compliant to meet modern environmental and manufacturing requirements.

Typical Applications

• Portable and Handheld Devices  Low-power Cyclone III characteristics help extend battery life in portable and handheld equipment that require programmable logic and embedded memory.
• Industrial Control and Automation  Industrial temperature rating and extensive I/O make this device suitable for control systems, monitoring, and interface bridging in industrial environments.
• High-Volume, Cost-Sensitive Products  Cyclone III family positioning for low cost and low power fits applications where unit cost and energy consumption are primary constraints.
• Embedded Processing and Peripheral Integration  On-chip memory and family-level support for embedded processor options and pre-built IP enable compact system integration and custom logic acceleration.

Unique Advantages

• Significant Logic Density: 39,600 logic elements enable substantial custom logic integration on a single device, reducing the need for multiple discrete components.
• On-Chip Memory for System Functions: Approximately 1.16 Mbits of embedded RAM supports buffering, packet processing, and intermediate data storage without external memory.
• Large I/O Count: 195 I/Os simplify board-level partitioning and allow multiple parallel interfaces without additional bridge ICs.
• Industrial Reliability: −40 °C to 100 °C operating range and surface-mount 324-FBGA packaging support robust deployment in industrial environments.
• Low-Power Family Design: Family-level low-power optimizations make the device suitable for thermally constrained or battery-powered designs.
• Environmentally Compliant: RoHS compliance aligns the device with current manufacturing and regulatory expectations.

Why Choose EP3C40F324I7?

The EP3C40F324I7 delivers a balanced combination of logic capacity, embedded memory, and I/O density in a low-power Cyclone III FPGA platform. Its industrial temperature rating, compact 324-FBGA package, and family-level features for low static power make it well suited to designers building cost- and power-sensitive systems that still require significant programmable logic.

This device is a pragmatic choice for engineering teams seeking a proven FPGA architecture with pre-built IP options and embedded processing possibilities from the Cyclone III family, enabling scalable designs with manageable BOM and board complexity.

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