EP3C40F324C7

The EP3C40F324C7 is a Cyclone® III field-programmable gate array (FPGA) in a 324-ball BGA package targeted at commercial embedded designs. Built on the Cyclone III device family architecture, it delivers mid-range logic capacity, substantial on-chip memory and flexible I/O for applications that require low-power, cost-sensitive programmable logic.

With 39,600 logic elements, approximately 1.16 Mbits of embedded memory, and 195 user I/Os, this device is positioned for system integration tasks such as protocol bridging, custom peripherals, and control logic where power efficiency and design flexibility matter.

Key Features

• Core Density: 39,600 logic elements suitable for mid-range programmable logic integration and custom datapath implementations.
• Embedded Memory: Approximately 1.16 Mbits of on-chip RAM to support buffering, lookup tables, and small embedded data structures.
• I/O Capacity and Standards: 195 user I/Os to support multiple interfaces and peripheral connectivity; the Cyclone III family supports a wide range of I/O standards.
• Low-Voltage Operation: Core supply range of 1.15 V to 1.25 V to match low-power system rails and reduce overall power footprint.
• Clock Management: Family-level support for multiple phase-locked loops (PLLs) for robust clock synthesis and distribution within the device.
• Package and Mounting: Surface-mount 324-ball FBGA in a 324-BGA package (supplier package: 324-FBGA (19×19)) for compact board-level integration.
• Operating Range: Commercial temperature grade specified for 0 °C to 85 °C operation.
• Regulatory: RoHS compliant for lead-free assembly and environmental compliance.

Typical Applications

• Embedded Systems: Implement custom control logic, peripheral interfaces, or accelerators where 39,600 logic elements and on-chip RAM provide needed resources.
• Communications & Networking: Protocol bridging, packet pre-processing, or medium-rate interface adaptation leveraging the device’s I/O count and programmable logic.
• Industrial Control: Sensor aggregation, motor-control glue logic, and machine I/O where low-power operation and a commercial temperature range are appropriate.
• Portable and Handheld Electronics: Low-power Cyclone III family characteristics support extended battery life and thermally constrained designs in portable products.

Unique Advantages

• Balanced Logic and Memory: Combines 39,600 logic elements with approximately 1.16 Mbits of embedded RAM to accommodate both control logic and modest on-chip data storage.
• High I/O Count: 195 user I/Os enable multiple external interfaces without excessive external glue logic, reducing BOM and board complexity.
• Low-Voltage Core: 1.15 V–1.25 V supply range aligns with modern low-voltage system designs to help reduce system power consumption.
• Compact BGA Package: 324-ball FBGA (324-BGA, 19×19) offers high integration density for space-constrained PCBs.
• Family-Level Power Optimizations: Built on a low-power process and device-level power optimizations (Cyclone III family), suitable for cost- and power-sensitive applications.
• Design Ecosystem: Access to Cyclone III family features such as PLLs and available family IP (including options like the Nios II embedded processor) to accelerate development and integration.

Why Choose EP3C40F324C7?

The EP3C40F324C7 positions itself as a practical mid-range Cyclone III FPGA that balances logic capacity, embedded memory and I/O resources in a compact BGA package. Its low-voltage core and family-level power optimizations make it a suitable choice for cost- and power-conscious commercial designs that need programmable flexibility without excess complexity.

Engineers building control systems, protocol adapters, or embedded peripherals will find the EP3C40F324C7 an effective platform for consolidating discrete logic, reducing board-level components, and leveraging the Cyclone III device family’s available IP and clock-management features.

Request a quote or submit an inquiry to start procurement for EP3C40F324C7 and evaluate how this Cyclone III FPGA can fit into your next design.