EP3C40F324C6

IC FPGA 195 I/O 324FBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 195 1161216 39600 324-BGA

Quantity 512 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package324-FBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-BGANumber of I/O195Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2475Number of Logic Elements/Cells39600
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1161216

Overview of EP3C40F324C6 – Cyclone® III Field Programmable Gate Array (FPGA) IC 195 1161216 39600 324-BGA

The EP3C40F324C6 is an Intel Cyclone® III FPGA offering a balance of logic capacity, embedded memory and I/O for commercial applications. As part of the Cyclone III device family, it targets low-power, cost-sensitive designs that require moderate logic density and flexible system integration.

Key device metrics include 39,600 logic elements, approximately 1.16 Mbits of embedded memory, 195 user I/Os, a 324-BGA package (324-FBGA 19×19), a core supply range of 1.15–1.25 V, and a commercial operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

  • Logic Capacity  39,600 logic elements provide the programmable fabric for glue logic, protocol handling, and mid-range custom processing.
  • Embedded Memory  Approximately 1.16 Mbits of on-chip RAM enables buffering, FIFOs, and small data stores without external memory.
  • I/O Density  195 user I/Os support multiple parallel interfaces and board-level connectivity for mixed-signal and digital peripherals.
  • Clock Management  Cyclone III family devices include integrated PLL resources for flexible clock synthesis and distribution (family-level feature).
  • Low-Power Architecture  Built on a low-power process with power-aware design optimizations to reduce static and dynamic power in portable or thermally constrained systems (family-level feature).
  • Package & Mounting  324-BGA (supplier package: 324-FBGA (19×19)), surface-mount package suitable for compact PCB footprints.
  • Supply & Temperature  Core voltage 1.15–1.25 V and commercial operating range of 0 °C to 85 °C, matching standard commercial designs and environments.
  • Compliance  RoHS compliant for environmental and lead-free assembly requirements.

Typical Applications

  • Portable and Battery-Powered Devices  Low-power family characteristics help extend battery life and reduce cooling requirements in handheld equipment.
  • Consumer and Embedded Systems  On-chip memory and substantial I/O make the device suitable for user-interface control, peripheral bridging, and embedded logic tasks.
  • Communications and Networking  High I/O count and programmable logic enable protocol adaptation, interface bridging, and mid-range packet-processing functions.
  • Industrial Control and Instrumentation  Flexible I/O and FPGA programmability allow implementation of sensor interfacing, signal conditioning control logic, and custom timing functions within commercial-temperature systems.

Unique Advantages

  • Balanced Logic and Memory  39,600 logic elements paired with approximately 1.16 Mbits of embedded RAM let designers implement control, buffering, and processing without immediate reliance on external memories.
  • High I/O Count  195 user I/Os simplify integration with multiple peripherals and parallel interfaces, reducing board-level glue logic.
  • Low-Power Family Characteristics  Cyclone III family optimizations for low-power operation support longer battery life and reduced thermal management in dense systems.
  • Compact Surface-Mount Package  324-BGA (324-FBGA 19×19) provides a high-pin-count, compact footprint for space-constrained PCB designs.
  • Commercial Temperature and Supply Compatibility  Designed for a 1.15–1.25 V supply and 0 °C to 85 °C operation to match common commercial design requirements.
  • RoHS Compliant  Meets lead-free and environmental requirements for modern electronics manufacturing.

Why Choose EP3C40F324C6?

EP3C40F324C6 positions itself as a practical Cyclone III FPGA option for commercial designs that need substantial logic capacity, embedded memory, and a high I/O count in a compact BGA package. Its combination of approximately 1.16 Mbits of on-chip RAM and 39,600 logic elements supports a wide range of mid-range processing, interface, and control functions without excessive external components.

Designed within the Cyclone III family, the device benefits from low-power process optimizations and family-level system features, making it suitable for cost-sensitive and power-aware designs that require reliable programmability and straightforward board integration.

Request a quote or submit an inquiry to receive pricing and availability for EP3C40F324C6 and to discuss how this Cyclone® III FPGA can fit into your next design.

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