EP3C40F324C6
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 195 1161216 39600 324-BGA |
|---|---|
| Quantity | 512 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-BGA | Number of I/O | 195 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2475 | Number of Logic Elements/Cells | 39600 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1161216 |
Overview of EP3C40F324C6 – Cyclone® III Field Programmable Gate Array (FPGA) IC 195 1161216 39600 324-BGA
The EP3C40F324C6 is an Intel Cyclone® III FPGA offering a balance of logic capacity, embedded memory and I/O for commercial applications. As part of the Cyclone III device family, it targets low-power, cost-sensitive designs that require moderate logic density and flexible system integration.
Key device metrics include 39,600 logic elements, approximately 1.16 Mbits of embedded memory, 195 user I/Os, a 324-BGA package (324-FBGA 19×19), a core supply range of 1.15–1.25 V, and a commercial operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.
Key Features
- Logic Capacity 39,600 logic elements provide the programmable fabric for glue logic, protocol handling, and mid-range custom processing.
- Embedded Memory Approximately 1.16 Mbits of on-chip RAM enables buffering, FIFOs, and small data stores without external memory.
- I/O Density 195 user I/Os support multiple parallel interfaces and board-level connectivity for mixed-signal and digital peripherals.
- Clock Management Cyclone III family devices include integrated PLL resources for flexible clock synthesis and distribution (family-level feature).
- Low-Power Architecture Built on a low-power process with power-aware design optimizations to reduce static and dynamic power in portable or thermally constrained systems (family-level feature).
- Package & Mounting 324-BGA (supplier package: 324-FBGA (19×19)), surface-mount package suitable for compact PCB footprints.
- Supply & Temperature Core voltage 1.15–1.25 V and commercial operating range of 0 °C to 85 °C, matching standard commercial designs and environments.
- Compliance RoHS compliant for environmental and lead-free assembly requirements.
Typical Applications
- Portable and Battery-Powered Devices Low-power family characteristics help extend battery life and reduce cooling requirements in handheld equipment.
- Consumer and Embedded Systems On-chip memory and substantial I/O make the device suitable for user-interface control, peripheral bridging, and embedded logic tasks.
- Communications and Networking High I/O count and programmable logic enable protocol adaptation, interface bridging, and mid-range packet-processing functions.
- Industrial Control and Instrumentation Flexible I/O and FPGA programmability allow implementation of sensor interfacing, signal conditioning control logic, and custom timing functions within commercial-temperature systems.
Unique Advantages
- Balanced Logic and Memory 39,600 logic elements paired with approximately 1.16 Mbits of embedded RAM let designers implement control, buffering, and processing without immediate reliance on external memories.
- High I/O Count 195 user I/Os simplify integration with multiple peripherals and parallel interfaces, reducing board-level glue logic.
- Low-Power Family Characteristics Cyclone III family optimizations for low-power operation support longer battery life and reduced thermal management in dense systems.
- Compact Surface-Mount Package 324-BGA (324-FBGA 19×19) provides a high-pin-count, compact footprint for space-constrained PCB designs.
- Commercial Temperature and Supply Compatibility Designed for a 1.15–1.25 V supply and 0 °C to 85 °C operation to match common commercial design requirements.
- RoHS Compliant Meets lead-free and environmental requirements for modern electronics manufacturing.
Why Choose EP3C40F324C6?
EP3C40F324C6 positions itself as a practical Cyclone III FPGA option for commercial designs that need substantial logic capacity, embedded memory, and a high I/O count in a compact BGA package. Its combination of approximately 1.16 Mbits of on-chip RAM and 39,600 logic elements supports a wide range of mid-range processing, interface, and control functions without excessive external components.
Designed within the Cyclone III family, the device benefits from low-power process optimizations and family-level system features, making it suitable for cost-sensitive and power-aware designs that require reliable programmability and straightforward board integration.
Request a quote or submit an inquiry to receive pricing and availability for EP3C40F324C6 and to discuss how this Cyclone® III FPGA can fit into your next design.

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