EP3C40F324C6N

The EP3C40F324C6N is a Cyclone® III Field Programmable Gate Array (FPGA) IC designed for low-power, high-functionality applications. Based on the Cyclone III device family, it targets high-volume, cost-sensitive designs where integration, power efficiency, and flexible I/O are important.

This commercial-grade device provides a balance of programmable logic, embedded memory, and clocking resources suited for portable, consumer, and general embedded systems operating in a 0 °C to 85 °C range.

Key Features

• Programmable Logic — 39,600 logic elements for implementing custom digital functions, state machines, and datapaths.
• Embedded Memory — Approximately 1.16 Mbits of on-chip RAM to support buffering, FIFOs, and storage for implemented logic.
• I/O Capacity — 195 user I/O pins to interface with sensors, peripherals, and external devices while enabling flexible board-level connectivity.
• Clock Management — Family-level support for multiple phase-locked loops (PLLs) for clock synthesis and distribution (as described in Cyclone III device documentation).
• Low-Power Technology — Device family optimized for low power through TSMC low-power process technology and power-aware design flows as documented for Cyclone III devices.
• Power Supply — Core voltage operation between 1.15 V and 1.25 V.
• Package & Mounting — 324-ball FBGA (19 × 19) package, surface-mount; package case: 324-BGA.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation.
• Standards Compliance — RoHS compliant.

Typical Applications

• Portable and Handheld Devices — Low-power operation and compact FBGA packaging make the device suitable for battery-powered or space-constrained designs.
• Consumer Electronics — High logic density and embedded memory support user interfaces, media processing blocks, and peripheral aggregation.
• Embedded Control & Signal Processing — Programmable logic and on-chip RAM support custom control algorithms, protocol bridging, and buffering tasks.
• High-Volume, Cost-Sensitive Products — Cyclone III family positioning emphasizes low-cost and low-power solutions for large-volume deployments.

Unique Advantages

• High Logic Density: 39,600 logic elements enable complex custom logic integration on a single device, reducing board-level component count.
• Integrated On-Chip Memory: Approximately 1.16 Mbits of embedded RAM minimizes the need for external memory in many buffering and storage applications.
• Ample I/O: 195 I/O pins provide flexibility to connect sensors, peripherals, and external interfaces without additional multiplexing logic.
• Low-Power Design: Built on TSMC low-power process technology and supported by power-aware design flows to help meet thermal and battery life goals.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C, matching typical consumer and general-purpose embedded system requirements.
• Compact, Surface-Mount Package: 324-FBGA (19 × 19) provides a space-efficient form factor for dense PCB designs.

Why Choose EP3C40F324C6N?

The EP3C40F324C6N positions Cyclone III FPGA capability—substantial logic resources, embedded memory, and flexible I/O—in a compact, low-power commercial device. It is well suited for designers who need to consolidate discrete functions, accelerate time-to-market, and manage BOM cost in consumer and embedded product lines.

Backed by the Cyclone III family documentation and development ecosystem, this device supports proven design flows and pre-built IP to streamline implementation and updates while offering a scalable option for mid-range programmable logic requirements.

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