EP3C40F324C8N

The EP3C40F324C8N is a Cyclone® III family Field Programmable Gate Array (FPGA) in a 324-ball BGA package designed for commercial applications that require low power, high integration, and flexible I/O. This device provides 39,600 logic elements and approximately 1.16 Mbits of embedded memory, making it suitable for cost-sensitive, high-volume designs where efficient logic density and on-chip memory are important.

Targeted use includes portable and handheld systems, communications and interface bridging, and general-purpose embedded designs where low static power and a compact surface-mount 324-FBGA (19×19) footprint simplify board-level integration.

Key Features

• Logic Capacity — 39,600 logic elements to implement complex custom logic, state machines, and control functions.
• Embedded Memory — Approximately 1.16 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage without external memory.
• I/O Resources — 195 user I/Os to support rich peripheral interfacing and multiple external connections in I/O-constrained designs.
• Clock Management — Four phase-locked loops (PLLs) per device with five outputs each; cascadable and dynamically reconfigurable for flexible clocking and timing architectures.
• Low-Power Architecture — Based on low-power process and device-level optimizations to reduce static power for battery-operated and thermally constrained applications.
• Package & Mounting — 324-FBGA (19×19) package, surface-mount mounting type for compact PCB integration and automated assembly.
• Operating Range — Commercial grade operation with an operating temperature range of 0 °C to 85 °C and a core supply voltage range of 1.15 V to 1.25 V.
• Standards & Reliability — RoHS-compliant manufacturing and device packaging to meet modern environmental requirements.

Typical Applications

• Portable and Handheld Devices — Low-power Cyclone III architecture supports extended battery life and reduced cooling requirements for compact products.
• Interface Bridging and Protocol Conversion — High I/O count and flexible clocking make the device suitable for implementing bridge logic between peripherals and buses.
• Embedded Control and Signal Processing — Dense logic and on-chip RAM enable custom control, DSP preprocessing, and finite-state machine implementations without large external memory.
• High-Volume, Cost-Sensitive Products — Optimized for designs where low cost per unit and integrated functionality reduce BOM and board complexity.

Unique Advantages

• High Logic Density: 39,600 logic elements provide substantial on-chip programmable resources to consolidate multiple functions into a single device.
• Integrated On-Chip Memory: Approximately 1.16 Mbits of embedded RAM reduces dependence on external memory, simplifying design and lowering component count.
• Flexible Clocking: Four PLLs with multiple outputs and dynamic reconfiguration options enable robust clock management and multi-domain timing strategies.
• Extensive I/O: 195 user I/Os support diverse peripherals and interface topologies, helping to minimize external glue logic.
• Compact Surface-Mount Package: 324-FBGA (19×19) package enables dense PCB layouts and automated assembly for volume production.
• Commercial Grade and RoHS Compliant: Designed for 0 °C to 85 °C operation and manufactured to RoHS standards for broad commercial deployment.

Why Choose EP3C40F324C8N?

The EP3C40F324C8N combines a substantial logic fabric with on-chip memory, flexible clocking, and a high I/O count in a compact 324-FBGA package. Its low-power device family heritage and commercial operating range make it well suited to designers building cost-sensitive, battery-aware, and space-constrained systems that still demand significant programmable logic and local memory.

For engineering teams seeking scalable FPGA capacity with integrated resources and a mature device family ecosystem, this Cyclone III device delivers a balanced mix of integration, power efficiency, and board-level friendliness for a wide range of embedded and consumer designs.

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