EP3C40F484C6

The EP3C40F484C6 is a Cyclone® III family FPGA offered in a 484-ball BGA package. It delivers a balance of programmable logic, on-chip memory and I/O density suitable for commercial, low-power, and cost-sensitive designs.

Built on the Cyclone III device family architecture, this device targets applications that require mid-range logic capacity with significant I/O capability and low static power. Family-level features emphasize low-power operation, integrated clock management and a mature ecosystem of IP and tools.

Key Features

• Logic Capacity — 39,600 logic elements (LEs) for mid-range programmable logic integration.
• On-chip Memory — Approximately 1.16 Mbits of embedded memory to support buffering, FIFOs and user memory requirements.
• I/O Density — 331 user I/Os to support complex interfacing and board-level integration needs.
• Clock Management — Cyclone III family devices provide up to four phase-locked loops (PLLs) per device for flexible clock synthesis and distribution.
• Power and Supply — Core supply range of 1.15 V to 1.25 V, aligned with low-power family optimizations.
• Package and Mounting — 484-ball BGA (484-FBGA, 23×23) in a surface-mount package for compact PCB implementation.
• Operating Range — Commercial grade temperature range 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• Portable and Handheld Devices — Low-power family characteristics and modest logic density help extend battery life and reduce thermal burden in space-constrained designs.
• Consumer and High-Volume Electronics — Mid-range logic capacity and high I/O count make this device suited to cost-sensitive, high-volume product lines requiring flexible control and interface logic.
• Embedded Control and Signal Processing — Integrated memory and multiple PLLs support local buffering and clocking needs for control loops, sensor interfaces and protocol handling.
• Communications and I/O-Intensive Systems — High I/O availability enables protocol bridging, interface aggregation and custom I/O timing on a single chip.

Unique Advantages

• Substantial Logic and Memory in a Compact Package: 39,600 logic elements and ~1.16 Mbits of embedded memory in a 484-BGA footprint reduce board-level component count.
• High I/O Count for Complex Interfaces: 331 user I/Os enable multi-channel interfaces and flexible pin assignments without external glue logic.
• Low-Power Family Design: Cyclone III family optimizations and TSMC low-power process heritage support reduced static power consumption for thermally constrained designs.
• Robust Clocking Options: Up to four PLLs per device provide the flexibility to generate and manage multiple clock domains on-chip.
• Commercial-Grade Reliability: Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream commercial deployments.
• Surface-Mount BGA for Production Efficiency: 484-FBGA (23×23) packaging supports automated assembly and compact PCB layouts.

Why Choose EP3C40F484C6?

The EP3C40F484C6 positions itself as a practical mid-range FPGA option within the Cyclone III family, combining substantial programmable logic, useful embedded memory and robust I/O in a compact, surface-mount BGA package. Its supply voltage and commercial temperature rating make it suitable for a broad range of consumer, embedded and high-volume applications that prioritize power efficiency and integration.

Designers benefit from family-level features such as low-power process optimizations, multi-PLL clocking and the availability of Cyclone III ecosystem IP, enabling scalable designs and a clear upgrade path within the family.

Request a quote or submit an inquiry for EP3C40F484C6 to receive pricing and availability details for your next design.