EP3C40F484C7N

The EP3C40F484C7N is a Cyclone® III family FPGA from Intel designed for low-power, high-functionality applications. It integrates 39,600 logic elements and approximately 1.16 Mbits of embedded memory to support mid-range logic and memory requirements in cost-sensitive designs.

With 331 user I/Os, a 484-ball FBGA package (23 × 23 mm), and a supply voltage range of 1.15 V to 1.25 V, this commercial-grade, RoHS-compliant FPGA targets portable, communications, and general embedded system applications where power efficiency, I/O flexibility, and board-level integration are important.

Key Features

• Logic Capacity  39,600 logic elements for implementing medium-density combinational and sequential logic functions.
• Embedded Memory  Approximately 1.16 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage.
• I/O and Standards Support  331 user I/Os for broad interface options; Cyclone III family devices support a wide array of I/O standards and on-chip termination calibration across process, voltage, and temperature variations (family-level feature).
• Clock Management  Up to four phase-locked loops (PLLs) per device with five outputs per PLL, enabling flexible clock synthesis and distribution (family-level feature).
• Low-Voltage Operation  Core supply range of 1.15 V to 1.25 V to support low-power system designs.
• Package and Mounting  484-FBGA (23 × 23 mm) surface-mount package optimized for compact board layouts and thermal dissipation.
• Commercial Temperature Range  Rated for operation from 0 °C to 85 °C to suit standard commercial applications.
• Compliance  RoHS compliant, supporting regulatory and environmental requirements.
• Design Ecosystem (Family-Level)  Cyclone III family provides power-aware design flow, pre-built IP cores, and device-level features that support low-power, high-volume product designs (family-level information).

Typical Applications

• Portable and Handheld Devices  Low-power architecture and compact FBGA package support battery-powered designs requiring extended runtime and dense integration.
• Embedded Control and Signal Processing  Logic capacity and on-chip RAM enable custom controllers, protocol bridges, and mid-range signal processing tasks.
• I/O-Intensive Interfaces  High I/O count is suitable for systems that require multiple parallel or serial interfaces and custom I/O signaling.
• Consumer and Commercial Electronics  Commercial temperature rating and RoHS compliance align with mainstream consumer and business product requirements.

Unique Advantages

• High Integration: Consolidates logic, memory, and I/O in a single 484-FBGA package to reduce board area and BOM complexity.
• Substantial Logic Resource: 39,600 logic elements provide headroom for complex finite-state machines, custom accelerators, and glue logic.
• On-Chip Memory: Approximately 1.16 Mbits of embedded RAM for local buffering, lookup tables, and small data stores without external memory.
• Flexible Clocking: Multiple PLLs (family-level) enable independent clock domains and robust clock management for mixed-function systems.
• Design Ecosystem: Support for power-aware design flows and a library of verified IP (family-level) accelerates development and reduces time to market.
• Regulatory Ready: RoHS compliance eases integration into global product lines with environmental requirements.

Why Choose EP3C40F484C7N?

The EP3C40F484C7N positions itself as a practical choice for mid-range FPGA applications where a balance of logic capacity, embedded memory, and extensive I/O is required. Its Cyclone III family heritage emphasizes low-power operation and integration, making it well suited to high-volume, cost-sensitive designs that prioritize efficiency and compactness.

Engineers will find the device appropriate for a variety of commercial embedded applications, benefiting from family-level design resources and IP to accelerate development while maintaining control over power and interface requirements.

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