EP3C40F484C7N

IC FPGA 331 I/O 484FBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 331 1161216 39600 484-BGA

Quantity 928 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O331Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2475Number of Logic Elements/Cells39600
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1161216

Overview of EP3C40F484C7N – Cyclone® III Field Programmable Gate Array (FPGA) IC 331 1161216 39600 484-BGA

The EP3C40F484C7N is a Cyclone® III family FPGA from Intel designed for low-power, high-functionality applications. It integrates 39,600 logic elements and approximately 1.16 Mbits of embedded memory to support mid-range logic and memory requirements in cost-sensitive designs.

With 331 user I/Os, a 484-ball FBGA package (23 × 23 mm), and a supply voltage range of 1.15 V to 1.25 V, this commercial-grade, RoHS-compliant FPGA targets portable, communications, and general embedded system applications where power efficiency, I/O flexibility, and board-level integration are important.

Key Features

  • Logic Capacity  39,600 logic elements for implementing medium-density combinational and sequential logic functions.
  • Embedded Memory  Approximately 1.16 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage.
  • I/O and Standards Support  331 user I/Os for broad interface options; Cyclone III family devices support a wide array of I/O standards and on-chip termination calibration across process, voltage, and temperature variations (family-level feature).
  • Clock Management  Up to four phase-locked loops (PLLs) per device with five outputs per PLL, enabling flexible clock synthesis and distribution (family-level feature).
  • Low-Voltage Operation  Core supply range of 1.15 V to 1.25 V to support low-power system designs.
  • Package and Mounting  484-FBGA (23 × 23 mm) surface-mount package optimized for compact board layouts and thermal dissipation.
  • Commercial Temperature Range  Rated for operation from 0 °C to 85 °C to suit standard commercial applications.
  • Compliance  RoHS compliant, supporting regulatory and environmental requirements.
  • Design Ecosystem (Family-Level)  Cyclone III family provides power-aware design flow, pre-built IP cores, and device-level features that support low-power, high-volume product designs (family-level information).

Typical Applications

  • Portable and Handheld Devices  Low-power architecture and compact FBGA package support battery-powered designs requiring extended runtime and dense integration.
  • Embedded Control and Signal Processing  Logic capacity and on-chip RAM enable custom controllers, protocol bridges, and mid-range signal processing tasks.
  • I/O-Intensive Interfaces  High I/O count is suitable for systems that require multiple parallel or serial interfaces and custom I/O signaling.
  • Consumer and Commercial Electronics  Commercial temperature rating and RoHS compliance align with mainstream consumer and business product requirements.

Unique Advantages

  • High Integration: Consolidates logic, memory, and I/O in a single 484-FBGA package to reduce board area and BOM complexity.
  • Substantial Logic Resource: 39,600 logic elements provide headroom for complex finite-state machines, custom accelerators, and glue logic.
  • On-Chip Memory: Approximately 1.16 Mbits of embedded RAM for local buffering, lookup tables, and small data stores without external memory.
  • Flexible Clocking: Multiple PLLs (family-level) enable independent clock domains and robust clock management for mixed-function systems.
  • Design Ecosystem: Support for power-aware design flows and a library of verified IP (family-level) accelerates development and reduces time to market.
  • Regulatory Ready: RoHS compliance eases integration into global product lines with environmental requirements.

Why Choose EP3C40F484C7N?

The EP3C40F484C7N positions itself as a practical choice for mid-range FPGA applications where a balance of logic capacity, embedded memory, and extensive I/O is required. Its Cyclone III family heritage emphasizes low-power operation and integration, making it well suited to high-volume, cost-sensitive designs that prioritize efficiency and compactness.

Engineers will find the device appropriate for a variety of commercial embedded applications, benefiting from family-level design resources and IP to accelerate development while maintaining control over power and interface requirements.

Request a quote or submit an inquiry to check current availability and pricing for EP3C40F484C7N.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up