EP3C25U256I7N

The EP3C25U256I7N is an Intel Cyclone® III family field-programmable gate array (FPGA) in a 256-ball LFBGA package, designed for high-functionality, low-power, cost-sensitive designs. It integrates 24,624 logic elements and approximately 0.61 Mbits of embedded memory to support custom digital logic, control, and interface tasks in industrial and volume applications.

Built for low-power operation and system integration, this device targets applications requiring a balance of logic density, on-chip memory, and I/O capacity while operating across an industrial temperature range and a narrow core supply window.

Key Features

• Logic Capacity  24,624 logic elements and 1,539 LABs provide substantial combinational and sequential resources for medium-density FPGA designs.
• Embedded Memory  Approximately 0.61 Mbits of on-chip RAM to implement FIFOs, buffers, and local data storage without external memory.
• I/O Count & Package  156 user I/Os in a compact 256-LFBGA package (supplier format: 256-UBGA, 14×14 mm) to support dense board-level connectivity.
• Power and Supply  Core voltage range of 1.15 V to 1.25 V, enabling low-power core operation consistent with Cyclone III family characteristics.
• Clock Management  Cyclone III family architecture includes multiple PLLs for robust clock generation and distribution (family-level feature).
• I/O Flexibility  Family features support a wide set of I/O standards and adjustable slew rates to help optimize signal integrity (family-level capability).
• Industrial Temperature Range  Specified for operation from −40 °C to 100 °C, suitable for industrial and thermally challenged environments.
• Mounting & Compliance  Surface-mount package with RoHS compliance for modern assembly and regulatory needs.

Typical Applications

• Portable and Handheld Devices  Low-power Cyclone III architecture and compact package make the device suitable for battery-conscious, space-limited designs.
• Industrial Control  Industrial temperature rating and abundant I/Os allow the FPGA to handle sensor interfacing, real-time control, and I/O aggregation.
• Embedded Processing and Custom Logic  On-chip memory and logic fabric support application-specific accelerators, protocol handling, and custom control functions.
• High-Volume, Cost-Sensitive Products  Cyclone III family positioning for low power and low cost supports high-volume consumer and commercial applications where BOM and power matter.

Unique Advantages

• Balanced Logic and Memory: Combines 24,624 logic elements with ~0.61 Mbits of embedded RAM to implement complex logic and local data buffering without external memory.
• Compact, High-I/O Package: 156 I/Os in a 256-ball LFBGA (256-UBGA, 14×14) minimizes PCB area while preserving connectivity for I/O-rich designs.
• Low-Power Family Characteristics: Cyclone III family-level optimizations for low static power help meet tight power budgets in portable and thermally constrained applications.
• Industrial Robustness: Rated for −40 °C to 100 °C operation, supporting deployment in industrial and harsh-temperature environments.
• Narrow Core Voltage Window: 1.15 V–1.25 V supply range enables predictable power provisioning and thermal design.
• Regulatory Compliance: RoHS compliant to support modern manufacturing and environmental requirements.

Why Choose EP3C25U256I7N?

The EP3C25U256I7N offers a practical balance of logic density, embedded memory, and I/O capacity within the Cyclone III low-power family, making it well suited to medium-density FPGA designs where power, cost, and integration are primary concerns. Its industrial operating range and surface-mount 256-ball package provide durability and board-level density for embedded and control applications.

Designers seeking a device that supports custom logic, on-chip buffering, and robust clock management within a low-power FPGA family will find the EP3C25U256I7N aligns with requirements for scalable production, long-term deployment, and ecosystem resources associated with the Cyclone III family.

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