EP3C25U256C8

The EP3C25U256C8 is a Cyclone III family FPGA optimized for low power and cost-sensitive applications. As a member of the Cyclone III device family, it leverages TSMC low-power process technology and silicon-level optimizations to deliver a balance of performance, integration, and energy efficiency for high-volume designs.

Designed for commercial-temperature systems, this surface-mount 256‑LFBGA device provides a substantial logic fabric, embedded memory, and a broad I/O count—making it suitable for applications that require on-chip flexibility, programmable logic, and efficient power operation.

Key Features

• Logic Capacity  Approximately 24,624 logic elements for implementing custom digital functions and control logic.
• Embedded Memory  Approximately 0.61 Mbits of on-chip RAM (608,256 total RAM bits) for buffering, LUTRAM, and small working datasets.
• I/O Density  156 user I/Os to support multiple interfaces and parallel connections to peripherals and external devices.
• Low‑Voltage Core  Core voltage range of 1.15 V to 1.25 V to support the Cyclone III low-power architecture.
• Package & Mounting  256‑LFBGA package (supplier package: 256‑UBGA 14×14) in a surface-mount form factor suitable for compact PCB layouts.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for standard commercial applications.
• RoHS Compliant  Manufactured to meet RoHS environmental standards.
• Cyclone III Family Capabilities  Leverages family features such as low-power process technology, multiple on-chip PLLs for flexible clocking, adjustable I/O slew rates, and a wide set of supported I/O standards (as provided by the Cyclone III device family).

Typical Applications

• Portable and Handheld Products  Low-power characteristics make the device suited for battery-powered equipment that requires programmable logic and moderate on-chip memory.
• Consumer Electronics  Use for custom control, interface bridging, and feature integration where a balance of logic capacity and I/O count is needed.
• Embedded Control and Processing  Implement custom state machines, peripheral controllers, and lightweight embedded processing functions using the FPGA fabric and embedded memory.
• System Clocking and Interface Management  On-chip PLL resources and adjustable I/O properties support robust clock distribution and signal integrity for diverse interfaces.

Unique Advantages

• Low-power architecture: Reduced static power characteristics from the Cyclone III family help extend battery life and simplify thermal design.
• Balanced integration: Combines substantial logic capacity with embedded memory and high I/O count to reduce external components and overall BOM.
• Flexible clocking: Family-level PLL features enable multiple clock domains and dynamic clock management for complex timing requirements.
• Compact surface-mount package: 256‑LFBGA (14×14 UBGA supplier package) provides a small footprint for space-constrained PCBs.
• Commercial temperature rating: Rated 0 °C to 85 °C for standard commercial deployments.
• Environmentally compliant: RoHS compliance aligns with common environmental and manufacturing requirements.

Why Choose EP3C25U256C8?

The EP3C25U256C8 delivers a practical combination of logic density, embedded RAM, and I/O resources within the Cyclone III low-power FPGA family. It is well suited to designers seeking a cost-conscious, energy-efficient programmable device for commercial applications that demand on-chip flexibility and moderate integration.

With its surface-mount 256‑LFBGA package, commercial temperature rating, and RoHS compliance, this part is a solid choice for high-volume consumer and portable designs where predictable power and compact PCB integration are priorities. The Cyclone III family features—such as optimized low-power silicon and flexible clocking—support scalable designs and development flows.

Request a quote or submit an inquiry for pricing and availability of EP3C25U256C8 to begin your design evaluation and procurement process.