EP3C25U256C7

The EP3C25U256C7 is a Cyclone® III Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 256-LFBGA (256-UBGA, 14×14) package for surface-mount applications. As part of the Cyclone III device family, it targets high‑volume, low‑power and cost‑sensitive designs where a balance of logic capacity, embedded memory and I/O density is required.

This device provides 24,624 logic elements, approximately 0.61 Mbits of embedded memory, and 156 user I/Os while operating from a core voltage of 1.15 V to 1.25 V. It is characterized for commercial temperature operation (0 °C to 85 °C) and is RoHS compliant.

Key Features

• Logic Capacity  24,624 logic elements to implement moderate-density digital logic, control and data-path functions.
• Embedded Memory  Approximately 0.61 Mbits of on-chip RAM for buffering, FIFOs and small data stores without external memory.
• I/O Count & Flexibility  156 user I/Os to support parallel interfaces, GPIO and external device connectivity in I/O‑constrained designs.
• Core Voltage  Low-voltage core supply of 1.15 V to 1.25 V to support power-efficient system designs.
• Package & Mounting  256-LFBGA (256-UBGA, 14×14) surface-mount package for compact board layouts and high‑density assemblies.
• Temperature & Grade  Commercial grade operation from 0 °C to 85 °C suitable for standard commercial and consumer products.
• Family-Level Power and Integration  As a Cyclone III device, the family emphasizes low-power operation and system integration features designed to reduce power consumption and component count.
• Compliance  RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• Portable and Handheld Devices  Low-voltage core and family-level low-power design help extend battery life in portable, battery-powered products.
• Consumer Electronics  Moderate logic and embedded memory enable user interface control, protocol bridging and on‑device data handling in consumer systems.
• Embedded Control and Automation  Sufficient logic density and I/O count for motor control, sensor interfacing and custom control logic in commercial automation equipment.
• High-Volume, Cost-Sensitive Products  Cyclone III family positioning and device integration provide a cost-conscious FPGA option for high-volume applications.

Unique Advantages

• High Logic Density for Mid-Range Designs: 24,624 logic elements provide the capacity to implement complex control, glue-logic and data-path functions without external ASICs.
• On-Chip Memory Reduces BOM: Approximately 0.61 Mbits of embedded RAM lowers dependence on external memory, simplifying board design and reducing component count.
• Generous I/O Count: 156 user I/Os accommodate multiple parallel interfaces and expandability for I/O-intensive applications.
• Low-Voltage Core: 1.15 V–1.25 V core supply supports power-efficient designs and aligns with low-power system architectures.
• Compact BGA Package: 256-LFBGA (14×14) enables compact PCB layouts while supporting robust surface-mount assembly.
• RoHS Compliant: Environmentally compliant manufacturing and assembly for global production requirements.

Why Choose EP3C25U256C7?

The EP3C25U256C7 delivers a balanced combination of mid-range logic, embedded memory and high I/O count in a compact 256-LFBGA package, making it well suited for commercial, cost-sensitive products that require on-chip integration and low-voltage operation. Its place in the Cyclone III family provides access to family-level low-power architecture and the Cyclone III device resources and documentation for development and integration.

Choose this device when your design requires a reliable commercial-grade FPGA with substantive logic capacity, on-chip RAM and flexible I/O, while maintaining a focus on power efficiency and a compact board footprint.

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