EP3C25U256C8N

The EP3C25U256C8N is an Intel Cyclone® III Field Programmable Gate Array (FPGA) in a 256‑LFBGA (256‑UBGA 14×14) package. It delivers 24,624 logic elements, approximately 0.6 Mbits of embedded memory, and 156 user I/Os in a commercial‑grade, surface‑mount device.

Designed as part of the Cyclone III device family, this FPGA targets low‑power, cost‑sensitive designs that require moderate logic density, flexible I/O and compact package integration.

Key Features

• Logic Capacity  24,624 logic elements and 1,539 configurable logic blocks (CLBs) to implement combinational and sequential logic.
• Embedded Memory  Approximately 0.6 Mbits (608,256 bits) of on‑chip RAM for buffering, FIFOs and small data stores.
• I/O Resources  156 user I/Os to support multiple interfaces and board‑level connectivity while minimizing external glue logic.
• Power Supply  Core voltage operation from 1.15 V to 1.25 V to match system power rails and low‑power design goals.
• Package & Mounting  256‑lead LFBGA (256‑UBGA, 14×14) surface‑mount package for compact PCB integration.
• Operating Range & Grade  Commercial grade operation from 0 °C to 85 °C for standard embedded and consumer applications.
• Environmental Compliance  RoHS‑compliant construction to meet common environmental requirements.
• Cyclone III Family Capabilities  Benefits associated with the Cyclone III family include low‑power silicon optimizations, multi‑PLL clock management, and a range of architecture and IP features for system integration (family level).

Typical Applications

• Portable and Handheld Devices  Low‑power family characteristics and compact package make the part suitable for battery‑sensitive portable designs that require reconfigurable logic.
• Consumer and Embedded Systems  Use for control, glue logic, and peripheral aggregation where moderate logic density and multiple I/Os are required.
• High‑I/O Interfaces  Ideal for systems that need to consolidate multiple I/O protocols into a single device thanks to 156 user I/Os.
• Prototyping and Volume Production  Surface‑mount 256‑LFBGA package and Cyclone III family heritage support both prototype validation and scaled manufacturing for cost‑sensitive designs.

Unique Advantages

• Moderate Logic Density:  24,624 logic elements provide ample capacity for mid‑range logic integration without excessive cost or board area.
• On‑Chip Memory:  Approximately 0.6 Mbits of embedded RAM reduces the need for external memory in many buffering and control use cases.
• Flexible I/O Count:  156 I/Os let you implement multiple interfaces and reduce external bridge components.
• Compact, Surface‑Mount Package:  256‑LFBGA (14×14 UBGA) enables dense PCB layouts while maintaining robust electrical performance.
• Low‑Voltage Operation:  1.15 V to 1.25 V core supply supports low‑power system architectures and helps meet modern power budgets.
• Family‑Level Integration Features:  Cyclone III family features such as low‑power process optimizations and multi‑PLL clocking provide design flexibility and system integration options (family level).

Why Choose EP3C25U256C8N?

The EP3C25U256C8N positions itself as a practical solution for designs that require mid‑range programmable logic, a healthy complement of on‑chip memory and a substantial I/O count in a compact surface‑mount package. As a member of the Cyclone III family from Intel, it benefits from a focus on low power and integration that aligns with cost‑sensitive and size‑constrained projects.

This device is well suited to engineers building consumer, portable, and embedded systems who need a reconfigurable component that balances logic capacity, I/O flexibility and power efficiency while remaining within commercial operating temperature limits.

Request a quote or submit an inquiry to get pricing and availability for EP3C25U256C8N and to discuss volume options for your next design.