EP3C25U256C6N

The EP3C25U256C6N is a Cyclone® III FPGA from Intel, delivered in a 256-LFBGA surface-mount package. It provides 24,624 logic elements and 608,256 bits of embedded memory, with 156 user I/Os and a supply voltage range of 1.15 V to 1.25 V, designed for commercial-temperature systems (0 °C to 85 °C).

Built on the Cyclone III device family architecture, this device targets cost- and power-sensitive applications that require moderate logic density, on-chip memory, and a flexible I/O profile for system integration and control.

Key Features

• Logic Capacity  24,624 logic elements suitable for mid-range programmable logic tasks and custom digital functions.
• Embedded Memory  608,256 bits of on-chip RAM (approximately 0.608 Mbits) to implement FIFOs, small buffers, and memory-mapped functions without external SRAM.
• I/O Count and Flexibility  156 user I/Os in a 256-LFBGA package, enabling multiple external interfaces and system-level connectivity with adjustable I/O slew and support for a wide range of signaling options documented for the Cyclone III family.
• Power Supply  Core supply range of 1.15 V to 1.25 V for compatibility with low-voltage system designs.
• Package and Mounting  256-LFBGA (supplier package 256-UBGA, 14×14) surface-mount package for compact PCB footprints and automated assembly.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for standard commercial applications.
• Family-Level Low-Power Design  Based on Cyclone III family features that emphasize low static power through a low-power process and power-aware design flow.
• Clock Management (Family Capability)  Cyclone III devices provide multiple PLLs and flexible clocking options at the family level to support robust clock synthesis and distribution.
• RoHS Compliant  Conforms to RoHS environmental requirements.

Typical Applications

• Embedded Control and Processing  Implement control logic, glue logic, and custom state machines using the device's logic elements and embedded RAM for mid-range embedded designs.
• Communication Interfaces  Use the 156 I/Os and family-supported I/O standards to implement protocol adapters, bus bridges, and I/O aggregation in communication equipment.
• Consumer and Portable Electronics  Leverage the Cyclone III family’s low-power characteristics and compact 256-LFBGA packaging for battery-aware or space-constrained consumer devices.
• System Integration and Prototyping  Integrate custom peripherals, data buffering, and timing logic where on-chip memory and configurable logic simplify board-level design.

Unique Advantages

• Balanced Logic and Memory:  24,624 logic elements combined with 608,256 bits of embedded RAM provide balanced resources for moderate-complexity designs without relying on external memory.
• Compact, Surface-Mount Packaging:  256-LFBGA (14×14 UBGA) offers a compact footprint for space-constrained PCBs while supporting automated assembly.
• Commercial Temperature Rating:  Rated 0 °C to 85 °C to meet standard commercial deployment requirements.
• Low-Voltage Core:  1.15 V to 1.25 V core supply supports low-voltage system architectures and power budgeting.
• Family-Level Power and Clock Features:  Benefits from Cyclone III family optimizations such as low-power process technology and flexible PLL-based clock management to simplify timing and reduce power.
• RoHS Compliance:  Environmentally compliant for regulatory and manufacturing consistency.

Why Choose EP3C25U256C6N?

The EP3C25U256C6N places Cyclone III family capabilities into a compact, commercial-grade 256-LFBGA package, delivering a straightforward balance of logic, embedded memory, and I/O for mid-range FPGA tasks. Its low-voltage core and family-level low-power optimizations make it appropriate for designs that must manage power without sacrificing integration.

This device is suited to engineers and teams designing cost- and power-conscious systems that require on-chip RAM, substantial logic elements, and flexible I/O in a compact surface-mount package—with the long-term benefit of Cyclone III family documentation and design resources.

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