EP3C25Q240C8
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 148 608256 24624 240-BFQFP |
|---|---|
| Quantity | 616 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 148 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1539 | Number of Logic Elements/Cells | 24624 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 608256 |
Overview of EP3C25Q240C8 – Cyclone® III FPGA, 240-BFQFP
The EP3C25Q240C8 is a Cyclone III family field-programmable gate array (FPGA) in a 240-pin BFQFP surface-mount package. As a member of the Cyclone III family, it combines a mid-range logic capacity with embedded memory and system-level features aimed at cost- and power-sensitive applications across consumer, communications, and industrial-commercial designs.
Key Features
- Logic Capacity — 24,624 logic elements (LEs) to implement custom logic functions and moderate-complexity designs.
- Embedded Memory — Approximately 0.61 Mbits of on-chip RAM (608,256 bits) for buffering, FIFOs, and small data stores.
- I/O Count & Standards — 148 user I/O pins with support across a wide range of I/O standards listed for the Cyclone III family, enabling flexible interfacing to peripherals and external devices.
- Clock Management — Family features include up to four phase-locked loops (PLLs) per device for clock synthesis and distribution.
- Power — Designed as a low-power Cyclone III device; core supply requirement is specified at 1.15 V to 1.25 V.
- Package & Mounting — Surface-mount 240-BFQFP package; supplier device package referenced as 240-PQFP (32×32) to suit standard PCB footprints.
- Operating Range — Commercial-grade operation from 0 °C to 85 °C.
- Compliance — RoHS compliant for lead-free manufacturing processes.
Typical Applications
- Consumer Electronics — Implement control logic, user interfaces, and peripheral aggregation where moderate logic and embedded memory are required.
- Communications — Protocol bridging, packet buffering, and timing control using the device’s I/O flexibility and PLL resources.
- Industrial & Commercial Systems — Control and signal-processing functions in equipment operating within commercial temperature ranges.
- Embedded System Integration — Custom glue logic, state machines, and small-data buffering leveraging on-chip RAM and plentiful I/Os.
Unique Advantages
- Balanced Logic and Memory: 24,624 logic elements paired with approximately 0.61 Mbits of embedded RAM provide the right mix for mid-range FPGA tasks without overprovisioning.
- Flexible I/O Support: 148 user I/Os and Cyclone III family support for a broad set of I/O standards simplify board-level interfacing and speed time-to-market.
- Integrated Clocking: Multiple PLLs included in the Cyclone III family enable robust clock management for synchronous designs and interface timing.
- Low-Voltage Core: Narrow core supply range (1.15 V–1.25 V) aligns with low-power design goals and predictable power budgeting.
- Commercial-Grade Reliability: Specified operation from 0 °C to 85 °C and surface-mount 240-BFQFP packaging support standard commercial installations and production processes.
- Regulatory Readiness: RoHS compliance supports lead-free assembly and environmental regulations.
Why Choose EP3C25Q240C8?
The EP3C25Q240C8 positions itself as a mid-range, low-power Cyclone III FPGA suitable for applications that require a substantial number of logic elements, embedded RAM, and broad I/O flexibility in a compact surface-mount footprint. Its combination of 24,624 logic elements, approximately 0.61 Mbits of on-chip memory, and up to 148 user I/Os makes it well suited for designers balancing integration, power, and cost.
As part of the Cyclone III family, this device benefits from family-level features such as multiple PLLs and support for many I/O standards, helping to shorten design cycles and support a variety of interfacing needs while maintaining predictable commercial-grade operation.
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