EP3C25F324I7N

The EP3C25F324I7N is an Intel Cyclone® III field programmable gate array (FPGA) packaged in a 324‑ball BGA (19×19) surface‑mount package. It provides 24,624 logic elements, approximately 0.61 Mbits of embedded memory, and up to 215 user I/Os for mid‑range integration in industrial applications.

As part of the Cyclone III device family, this FPGA targets high‑volume, low‑power, cost‑sensitive designs that require a balance of logic capacity, on‑chip memory and robust clock management while meeting industrial operating conditions.

Key Features

• Logic Capacity  24,624 logic elements for implementing complex combinational and sequential logic functions.
• On‑chip Memory  Total of 608,256 bits of embedded memory (approximately 0.61 Mbits) to support buffering, FIFOs and small data structures on chip.
• I/O Density  Up to 215 user I/Os to support multiple interfaces and peripherals without external glue logic.
• Power Supply  Core voltage range 1.15 V to 1.25 V to match typical Cyclone III power rails.
• Industrial Temperature  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Package & Mounting  324‑FBGA (19×19) surface‑mount package for compact board integration.
• Compliance  RoHS compliant to meet modern environmental and manufacturing requirements.
• Cyclone III Family Capabilities  Family features include a low‑power manufacturing process, multiple PLLs for robust clock management, support for dynamic clock reconfiguration, and an IP ecosystem including the Nios II embedded processor (as documented for the Cyclone III family).

Typical Applications

• Portable and Handheld Devices  Low‑power family characteristics and compact BGA packaging make this device suitable for power‑sensitive, space‑constrained products.
• Industrial Control & Automation  Industrial temperature rating and flexible I/O count enable sensor interfacing, motor control logic and process control applications.
• Interface Bridging and I/O Expansion  High I/O count and on‑chip memory support protocol translation, bus bridging and local buffering tasks.
• Embedded Systems & Prototyping  Family support for the Nios II embedded processor and available IP cores make it suitable for integrating custom logic with soft‑processor functions.

Unique Advantages

• Highly integrated logic and memory: Consolidates logic (24,624 elements) and on‑chip memory (≈0.61 Mbits) to reduce external components and board complexity.
• Industrial readiness: Rated −40 °C to 100 °C and supplied in a compact 324‑BGA package for reliable operation in industrial environments.
• Flexible I/O capacity: 215 user I/Os support multiple peripheral interfaces and simplify system integration without large external multiplexing.
• Power‑aware family design: Cyclone III family optimizations emphasize low static power, helping meet thermal and battery constraints in sensitive applications.
• Clock management: Family‑level PLL resources and dynamic reconfiguration support robust timing architectures and in‑system clock adjustments.
• Standards and tooling support: RoHS compliance and documented Cyclone III device family IP/toolchain support aid regulatory and development workflows.

Why Choose EP3C25F324I7N?

The EP3C25F324I7N combines a mid‑range logic capacity with measurable on‑chip memory and high I/O density in an industrial‑rated BGA package. It is positioned for designers who need a cost‑sensitive, low‑power FPGA platform with the integration required for embedded control, I/O bridging and compact system designs.

As a member of the Cyclone III family, it benefits from device‑level low‑power optimizations, clock management features and an established IP/tooling ecosystem, offering long‑term value for repeated designs and volume deployment.

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