EP3C25F324C8

The EP3C25F324C8 is a field-programmable gate array (FPGA) IC from Intel, based on the Cyclone® III device family. It combines a mid-range logic capacity with embedded memory and a high I/O count in a compact 324-ball BGA package for surface-mount assembly.

Designed for cost- and power-sensitive applications, this commercial-grade device delivers configurable logic, on-chip RAM and flexible I/O while operating within a 1.15 V to 1.25 V supply range and a 0 °C to 85 °C temperature window.

Key Features

• Logic Capacity — 24,624 logic elements suitable for mid-range programmable logic tasks and custom digital functions.
• Embedded Memory — Approximately 0.608 Mbits of on-chip RAM (608,256 bits) for buffering, state storage, and small data arrays.
• I/O — 215 user I/O pins to support diverse external interfaces and parallel connectivity.
• Power and Supply — Operates from a 1.15 V to 1.25 V core supply to meet low-voltage design constraints.
• Package and Mounting — 324-BGA (supplier package: 324-FBGA 19×19) in a surface-mount form factor for compact PCB layouts.
• Temperature and Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards and Compliance — RoHS compliant for environmental regulatory requirements.
• Cyclone III family capabilities — Family-level features include low-power silicon optimizations, on-device clock management (multiple PLLs), and available security options in LS variants; these line-level capabilities support power-efficient, integrated designs.

Typical Applications

• Portable and Handheld Devices — Low-power Cyclone III family optimizations help extend battery life while providing programmable logic for custom functions and interfaces.
• Consumer Electronics — Use for display control, user-interface processing, and peripheral bridging where moderate logic density and many I/Os are required.
• Embedded Control and Processing — Suitable for offloading control logic, implementing finite-state machines, and integrating soft-core processors from the Cyclone III ecosystem.
• Communication and I/O Bridging — Leverage 215 I/Os and family-level I/O standard support for protocol translation, buffering, and interface adaptation.

Unique Advantages

• Balanced Logic-to-Memory Ratio — 24,624 logic elements paired with approximately 0.608 Mbits of on-chip RAM provide a compact platform for mixed compute and storage tasks, reducing external memory needs.
• High I/O Count in a Compact Package — 215 I/Os in a 324-FBGA (19×19) package help minimize PCB area while maintaining connectivity for complex systems.
• Low-Voltage Operation — Narrow core supply range (1.15 V–1.25 V) suited to low-power architectures and modern power-rail designs.
• Commercial Temperature Range — Rated 0 °C to 85 °C to meet typical commercial embedded product requirements.
• RoHS Compliance — Meets lead-free and hazardous-substance directives for regulatory and market requirements.
• Cyclone III Ecosystem — Access to family-level features such as multiple PLLs, low-power silicon optimizations, and available embedded processor IP supports scalable design reuse and integration.

Why Choose EP3C25F324C8?

The EP3C25F324C8 positions itself as a practical, mid-density FPGA choice for designers seeking a balance of logic resources, embedded memory, and a high I/O count in a compact BGA package. Its commercial-temperature rating and RoHS compliance make it appropriate for a wide range of consumer and embedded applications where low power and PCB area efficiency matter.

Backed by the Cyclone III device family capabilities, this device is suitable for teams that require a configurable platform with family-level support for clock management, low-power optimization, and integrated IP options—enabling scalable designs and reduced system complexity.

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