EP3C25F324C6

IC FPGA 215 I/O 324FBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 215 608256 24624 324-BGA

Quantity 1,298 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package324-FBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-BGANumber of I/O215Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1539Number of Logic Elements/Cells24624
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits608256

Overview of EP3C25F324C6 – Cyclone® III Field Programmable Gate Array (FPGA) IC 215 I/O 608256 bits 24624 logic elements 324‑BGA

The EP3C25F324C6 is a Cyclone III family FPGA offering a combination of high functionality and low-power operation. Built on TSMC low-power process technology, this device targets high-volume, low-power and cost-sensitive applications that require flexible logic, embedded memory and extensive I/O.

With 24,624 logic elements and approximately 0.61 Mbits of embedded memory, the device delivers a balanced mix of logic density and on-chip RAM, plus 215 user I/Os in a compact 324‑FBGA (19×19) package for space-constrained boards.

Key Features

  • Core Logic — 24,624 logic elements provide the programmable fabric for custom digital functions and glue logic.
  • Embedded Memory — 608,256 bits (approximately 0.61 Mbits) of on-chip RAM for FIFOs, buffers and small data stores.
  • I/O Density and Flexibility — 215 user I/Os support high pin-count interfaces and board-level routing flexibility; family architecture supports a wide range of I/O standards for diverse signaling needs.
  • Clock Management — Four phase-locked loops (PLLs) per device enable robust clock synthesis, distribution and dynamic reconfiguration for phase/frequency changes without full reconfiguration.
  • Low-Power Operation — Designed on a TSMC low-power process; Cyclone III devices in the family deliver low static power (family-level static power under ¼ watt), supporting battery-powered and thermally constrained systems.
  • Package and Mounting — 324‑BGA (supplier package: 324‑FBGA 19×19) in a surface-mount form factor for compact board layouts.
  • Supply and Temperature — Core supply range 1.15 V to 1.25 V; commercial operating temperature from 0 °C to 85 °C.
  • Compliance — RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

  • Portable and Handheld Devices — Low static power behavior and modest on-chip memory make the device suitable for battery-powered applications that require programmable logic.
  • Consumer and High-Volume Electronics — Balanced logic density and I/O count support feature-rich consumer products where cost and board space are constrained.
  • Communications and Networking — Multiple PLLs and high I/O availability accommodate clocking requirements and diverse interface needs for mid-range networking equipment.
  • Test & Measurement and Instrumentation — Reconfigurable logic and on-chip RAM enable custom data acquisition front-ends, protocol handling and real-time processing.

Unique Advantages

  • Highly integrated programmable fabric: 24,624 logic elements and embedded memory reduce external components for many control and data-path functions.
  • Rich I/O capability: 215 user I/Os and support for many I/O standards give designers flexibility to interface with a wide variety of peripherals and signaling levels.
  • Robust clocking and timing control: Four PLLs per device enable complex clock domain management, frequency synthesis and dynamic clock adjustments without full device reconfiguration.
  • Low-power pedigree: TSMC low-power process and Cyclone III family optimizations keep static power low, helping extend battery life and reduce thermal management needs.
  • Compact, production-ready package: 324‑FBGA (19×19) surface-mount package provides a high pin count in a small board footprint for dense designs.
  • Compliance and manufacturing readiness: RoHS compliance and commercial-grade temperature range align with mainstream production requirements.

Why Choose EP3C25F324C6?

The EP3C25F324C6 positions itself as a practical, low-power Cyclone III FPGA option for engineers designing cost-sensitive, high-volume products. It offers a balanced combination of logic density, embedded RAM and high I/O count in a compact 324‑FBGA package, backed by device-family features such as multiple PLLs and support for a broad set of I/O standards.

This device is suited for developers looking to implement custom logic, protocol bridging, or mid-range data processing while maintaining strict power and board-space constraints. As part of the Cyclone III family, it benefits from the family’s power-aware design flow and ecosystem support for design tools and verified IP.

If you would like pricing, availability or a formal quote for EP3C25F324C6, request a quote or submit your purchasing inquiry today.

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