EP3C25F324A7N
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 215 608256 24624 324-BGA |
|---|---|
| Quantity | 379 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FBGA (19x19) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-BGA | Number of I/O | 215 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1539 | Number of Logic Elements/Cells | 24624 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 608256 |
Overview of EP3C25F324A7N – Cyclone® III Field Programmable Gate Array (FPGA) IC 215 608256 24624 324-BGA
The EP3C25F324A7N is a Cyclone III family FPGA delivering a balanced combination of logic capacity, embedded memory, and I/O density for cost- and power-sensitive designs. It provides 24,624 logic elements, approximately 0.61 Mbits of embedded memory, and 215 user I/Os in a compact 324-BGA package.
Qualified to AEC-Q100 and rated for –40 °C to 125 °C operation with a 1.15–1.25 V core supply, this device targets applications that require moderate logic resources, flexible I/O support, and automotive-grade qualification combined with the Cyclone III family’s low-power architecture.
Key Features
- Logic Capacity — 24,624 logic elements providing programmable fabric for custom logic, glue logic, and moderate-complexity processing tasks.
- Embedded Memory — 608,256 bits of on-chip RAM (approximately 0.61 Mbits) for buffering, FIFOs, and small lookup-table storage.
- High I/O Count — 215 user I/Os to support extensive peripheral, sensor, and bus interfacing needs.
- Low-Power Family Architecture — Built on the Cyclone III device family optimizations for low power, suitable for designs where power efficiency matters.
- Clock Management — Family-level support for multiple PLLs enables robust clock generation and distribution for system and I/O interfaces.
- Flexible I/O Standards — Cyclone III family support for a wide range of I/O standards and adjustable slew rates to improve signal integrity across interfaces.
- Automotive Qualification — AEC-Q100 qualification and automotive grade classification for use in vehicle electronics.
- Package and Mounting — 324-BGA (supplier package 324-FBGA, 19×19) surface-mount package suited for compact PCB layouts.
- Operating and Supply Range — Core supply range of 1.15–1.25 V and operating temperature range of –40 °C to 125 °C for extended thermal environments.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Automotive Electronics — Engine control, body electronics, sensor hubs, and other in-vehicle functions that require AEC-Q100 qualification and extended temperature range.
- Embedded Control and Interface — Custom control logic, protocol bridging, and peripheral aggregation where a mix of logic elements and high I/O count is needed.
- Low-Power, High-Volume Systems — Cost- and power-sensitive consumer or industrial systems that benefit from Cyclone III’s low-power architecture and compact footprint.
- Remote Upgradeable Designs — Systems that leverage Cyclone III family features for in-field configuration updates and flexible clocking for interface management.
Unique Advantages
- Balanced Integration: Combines 24,624 logic elements, approximately 0.61 Mbits of embedded memory, and 215 I/Os to reduce external components and simplify board design.
- Automotive-Grade Reliability: AEC-Q100 qualification and a –40 °C to 125 °C operating range support automotive application requirements.
- Power-Efficient Architecture: Cyclone III family optimizations for low power help extend system operating life and reduce cooling demands.
- Flexible Clocking and I/O: Multiple PLLs and broad family-level I/O standard support enable robust timing and signal integrity across diverse interfaces.
- Compact, PCB-Friendly Package: 324-BGA (19×19) surface-mount package supports high-density layouts while maintaining connection density.
- Standards and Compliance: RoHS compliance and documented device family features and IP support for streamlined development.
Why Choose EP3C25F324A7N?
The EP3C25F324A7N sits at the intersection of moderate logic capacity, substantial I/O resources, and automotive-grade reliability. It is well suited for designers needing a cost- and power-conscious FPGA solution with the Cyclone III family feature set and developer ecosystem support.
Choose this device when you need a compact, AEC-Q100-qualified FPGA that delivers flexible interfacing, embedded memory for local buffering, and the family-level power benefits and clocking capabilities that simplify system design and long-term deployment.
Request a quote or submit a sales inquiry to get pricing and availability for the EP3C25F324A7N.

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