EP3C25F324A7N

IC FPGA 215 I/O 324FBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 215 608256 24624 324-BGA

Quantity 379 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package324-FBGA (19x19)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case324-BGANumber of I/O215Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1539Number of Logic Elements/Cells24624
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits608256

Overview of EP3C25F324A7N – Cyclone® III Field Programmable Gate Array (FPGA) IC 215 608256 24624 324-BGA

The EP3C25F324A7N is a Cyclone III family FPGA delivering a balanced combination of logic capacity, embedded memory, and I/O density for cost- and power-sensitive designs. It provides 24,624 logic elements, approximately 0.61 Mbits of embedded memory, and 215 user I/Os in a compact 324-BGA package.

Qualified to AEC-Q100 and rated for –40 °C to 125 °C operation with a 1.15–1.25 V core supply, this device targets applications that require moderate logic resources, flexible I/O support, and automotive-grade qualification combined with the Cyclone III family’s low-power architecture.

Key Features

  • Logic Capacity — 24,624 logic elements providing programmable fabric for custom logic, glue logic, and moderate-complexity processing tasks.
  • Embedded Memory — 608,256 bits of on-chip RAM (approximately 0.61 Mbits) for buffering, FIFOs, and small lookup-table storage.
  • High I/O Count — 215 user I/Os to support extensive peripheral, sensor, and bus interfacing needs.
  • Low-Power Family Architecture — Built on the Cyclone III device family optimizations for low power, suitable for designs where power efficiency matters.
  • Clock Management — Family-level support for multiple PLLs enables robust clock generation and distribution for system and I/O interfaces.
  • Flexible I/O Standards — Cyclone III family support for a wide range of I/O standards and adjustable slew rates to improve signal integrity across interfaces.
  • Automotive Qualification — AEC-Q100 qualification and automotive grade classification for use in vehicle electronics.
  • Package and Mounting — 324-BGA (supplier package 324-FBGA, 19×19) surface-mount package suited for compact PCB layouts.
  • Operating and Supply Range — Core supply range of 1.15–1.25 V and operating temperature range of –40 °C to 125 °C for extended thermal environments.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • Automotive Electronics — Engine control, body electronics, sensor hubs, and other in-vehicle functions that require AEC-Q100 qualification and extended temperature range.
  • Embedded Control and Interface — Custom control logic, protocol bridging, and peripheral aggregation where a mix of logic elements and high I/O count is needed.
  • Low-Power, High-Volume Systems — Cost- and power-sensitive consumer or industrial systems that benefit from Cyclone III’s low-power architecture and compact footprint.
  • Remote Upgradeable Designs — Systems that leverage Cyclone III family features for in-field configuration updates and flexible clocking for interface management.

Unique Advantages

  • Balanced Integration: Combines 24,624 logic elements, approximately 0.61 Mbits of embedded memory, and 215 I/Os to reduce external components and simplify board design.
  • Automotive-Grade Reliability: AEC-Q100 qualification and a –40 °C to 125 °C operating range support automotive application requirements.
  • Power-Efficient Architecture: Cyclone III family optimizations for low power help extend system operating life and reduce cooling demands.
  • Flexible Clocking and I/O: Multiple PLLs and broad family-level I/O standard support enable robust timing and signal integrity across diverse interfaces.
  • Compact, PCB-Friendly Package: 324-BGA (19×19) surface-mount package supports high-density layouts while maintaining connection density.
  • Standards and Compliance: RoHS compliance and documented device family features and IP support for streamlined development.

Why Choose EP3C25F324A7N?

The EP3C25F324A7N sits at the intersection of moderate logic capacity, substantial I/O resources, and automotive-grade reliability. It is well suited for designers needing a cost- and power-conscious FPGA solution with the Cyclone III family feature set and developer ecosystem support.

Choose this device when you need a compact, AEC-Q100-qualified FPGA that delivers flexible interfacing, embedded memory for local buffering, and the family-level power benefits and clocking capabilities that simplify system design and long-term deployment.

Request a quote or submit a sales inquiry to get pricing and availability for the EP3C25F324A7N.

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