EP3C25F256I7

The EP3C25F256I7 is a Cyclone III family FPGA offering mid-range logic density and integration for cost- and power-sensitive embedded designs. It combines 24,624 logic elements with approximately 0.61 Mbits of embedded memory and 156 user I/Os in a 256-ball BGA package for compact, interface-rich applications.

Designed for industrial operating conditions, this device supports a 1.15–1.25 V core supply and an operating temperature range of -40 °C to 100 °C. As part of the Cyclone III device family, it benefits from the family’s low-power optimizations, integrated clock management, and broad I/O capability described in the device handbook.

Key Features

• Logic Capacity  24,624 logic elements provide mid-range density for control, signal processing, and glue-logic functions.
• On-chip Memory  Approximately 0.61 Mbits of embedded RAM for FIFOs, buffering, and local storage.
• I/O Count & Flexibility  156 user I/Os accommodate multiple interfaces and peripherals; the Cyclone III family documentation details support for a wide range of I/O standards.
• Clock Management  Family-level clock resources include multiple PLLs for robust clock synthesis and distribution (refer to the Cyclone III handbook for device-level PLL details).
• Power and Supply  Core supply range 1.15 V to 1.25 V consistent with low-power Cyclone III process and optimizations described in the family handbook.
• Package and Mounting  256-LBGA package (supplier package: 256-FBGA, 17 × 17 mm) for compact surface-mount system integration.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C, suitable for many industrial and embedded environments.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control  Motor drives, PLC I/O expansion and factory automation where industrial temperature operation and a high I/O count are required.
• Interface Bridging & Protocol Conversion  Protocol translation and glue logic between multiple peripherals, leveraging 156 I/Os and on-chip memory for buffering.
• Embedded System Controllers  Mid-density embedded control and preprocessing functions that benefit from a balanced mix of logic elements and embedded RAM.
• Portable and Thermally Challenged Devices  Low-power family characteristics cited in the Cyclone III handbook support designs with tight power budgets and thermally constrained enclosures.

Unique Advantages

• Balanced Logic and Memory:  24,624 logic elements paired with ~0.61 Mbits of embedded RAM enable versatile mid-range designs without excessive external memory.
• High I/O Integration:  156 user I/Os reduce external interface components and simplify PCB routing for multi-peripheral systems.
• Compact BGA Package:  256-LBGA (supplier 256-FBGA, 17 × 17) provides a small board footprint for space-constrained applications.
• Industrial Robustness:  -40 °C to 100 °C operating range supports deployment in demanding environments.
• Low-power Family Technology:  The Cyclone III family is documented for low-power operation, helping designs meet power and thermal targets.
• Standards-aligned Integration:  Family documentation covers flexible I/O standards and clocking features, enabling diverse system interfaces and reliable timing management.

Why Choose EP3C25F256I7?

The EP3C25F256I7 delivers a practical combination of mid-range logic density, on-chip memory, and a high I/O count in a compact BGA package targeted at industrial and embedded applications. Its documented Cyclone III family attributes—low-power process optimizations, integrated clock resources, and broad I/O support—help reduce system BOM and simplify board-level integration.

This device is well suited for engineers building interface-rich controllers, protocol bridges, and mid-complexity embedded systems that require industrial temperature operation and RoHS compliance. The EP3C25F256I7 provides a scalable, field-programmable building block backed by Cyclone III family documentation and design flows.

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