EP3C25F256C8N

The EP3C25F256C8N is a Cyclone III family FPGA offered in a 256-LBGA package, designed for cost- and power-sensitive digital designs. It provides a mid-range logic density with 24,624 logic elements and approximately 0.61 Mbits of embedded memory, alongside 156 user I/Os and support for standard FPGA system integration features.

This device targets applications requiring a balance of integration, low-power operation, and flexible I/O in a commercial-temperature, surface-mount package.

Key Features

• Logic Capacity — 24,624 logic elements suitable for mid-range FPGA designs and complex glue-logic implementations.
• On-chip Memory — Approximately 0.61 Mbits of embedded memory for buffering, lookup tables, and small data structures.
• I/O Density — 156 user I/Os to support multiple interfaces and peripheral connectivity.
• Clock Management — Cyclone III family devices include multiple PLLs for robust clock synthesis and distribution, enabling flexible clocking schemes.
• Low-Power Architecture — Cyclone III family devices are built on a low-power process and power-aware design flow to reduce static and dynamic power consumption.
• Package & Mounting — 256-LBGA (supplier listing: 256-FBGA 17×17) package, surface-mount suitable for compact board designs.
• Voltage & Temperature — Core supply range 1.15 V to 1.25 V; commercial operating temperature range of 0 °C to 85 °C.
• Standards & Integration — Cyclone III family supports a wide collection of I/O standards and system-level features (PLL outputs, on-chip termination calibration, and pre-built IP for common functions).
• RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

• Communications and Networking — Implement protocol bridging, timing and clock management, and I/O aggregation using the device’s multiple PLLs and plentiful I/Os.
• Embedded Control and Interfaces — Mid-density logic and embedded memory make the device suitable for control logic, sensor interfacing, and custom peripheral integration.
• Portable and Battery-Powered Products — Low-power device architecture supports designs with constrained power budgets where reduced static power matters.
• High-Volume, Cost-Sensitive Systems — The Cyclone III family’s focus on low cost and low power fits production designs that require reliable FPGA functionality at scale.

Unique Advantages

• Balanced Integration: Combines mid-range logic (24,624 elements), on-chip memory (~0.61 Mbits), and 156 I/Os to reduce external component count and simplify board design.
• Power-Aware Design: Low-power process technology and device-level optimizations help reduce system-level power consumption and cooling requirements.
• Flexible Clocking: Multiple PLLs provide versatile clock management and synthesis, enabling clean timing for multi-domain systems.
• Compact Package: 256-LBGA (256-FBGA, 17×17) surface-mount package allows a small PCB footprint for compact designs.
• Commercial-Temperature Rated: Operates across a 0 °C to 85 °C range, matching typical commercial electronics deployment environments.
• Regulatory Readiness: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose EP3C25F256C8N?

The EP3C25F256C8N offers a practical combination of mid-range logic capacity, on-chip memory, and generous I/O in a compact 256-LBGA surface-mount package. It is positioned for designers who need an FPGA that balances integration, low-power operation, and cost efficiency for commercial-temperature applications.

With Cyclone III family system features—such as multiple PLLs, a broad set of supported I/O standards, available pre-built IP, and the option to leverage the Nios II embedded processor within the family—this device provides a solid foundation for scalable, power-conscious designs in communications, embedded control, and high-volume products.

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