EP3C25F324C7

The EP3C25F324C7 is an Intel Cyclone® III field-programmable gate array supplied in a 324‑ball BGA package for surface-mount applications. Built on the Cyclone III device family architecture, it targets high-volume, cost‑sensitive and low‑power designs that require a balance of logic capacity, on‑chip memory and I/O density.

With 24,624 logic elements, approximately 0.61 Mbits of embedded memory and 215 user I/Os, this commercial‑grade FPGA is suitable for a wide range of embedded systems, interface bridging and control applications operating at a nominal core supply between 1.15 V and 1.25 V and an ambient temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity 24,624 logic elements provide substantial combinational and sequential resources for mid-range FPGA designs.
• Embedded Memory Approximately 0.61 Mbits of on‑chip RAM to support buffering, state storage and small lookup tables without external memory.
• I/O Density 215 user I/Os delivered in a 324‑BGA package to enable complex interfacing and board-level connectivity.
• Low‑Voltage Core Core supply range from 1.15 V to 1.25 V to support low‑power system designs.
• Package & Mounting 324‑BGA (supplier device package 324‑FBGA, 19×19) optimized for surface-mount assembly in compact layouts.
• Commercial Temperature Grade Rated for 0 °C to 85 °C ambient operation for typical commercial applications.
• Family Features Cyclone III family attributes include TSMC low‑power process optimizations, four phase‑locked loops (PLLs) per device for clock management, and a high memory‑to‑logic and multiplier‑to‑logic ratio for system integration.
• Standards & I/O Support The Cyclone III family supports a broad set of I/O standards and adjustable I/O slew rates to help manage signal integrity across interfaces.
• Regulatory RoHS compliant.

Typical Applications

• Embedded Control & Signal Processing Use the logic density and embedded RAM for control algorithms, finite state machines and small buffering tasks within embedded systems.
• Interface Bridging High I/O count makes the device suitable for protocol translation, bus bridging and multi‑interface glue logic on compact PCBs.
• Consumer & Industrial Electronics Commercial‑grade temperature range and low‑power operation fit applications such as consumer devices, instrumentation and automation equipment.
• Cost‑Sensitive Volume Designs The Cyclone III family focus on low power and low cost aligns this part with high‑volume products where BOM reduction and power budgets matter.

Unique Advantages

• Balanced Logic and Memory: 24,624 logic elements paired with approximately 0.61 Mbits of embedded memory reduce reliance on external components for many mid‑range designs.
• High I/O Count in a Compact Package: 215 user I/Os in a 19×19 324‑FBGA deliver flexible board‑level connectivity without increasing package footprint.
• Low‑Voltage Core: 1.15 V–1.25 V supply range helps minimize core power consumption in battery‑aware or thermally constrained systems.
• Clocking Flexibility: Family‑level support for four PLLs per device provides robust on‑chip clock generation and distribution for complex timing requirements.
• RoHS Compliance: Environmentally compliant manufacturing simplifies regulatory handling across regions.
• Proven Family Architecture: Builds on Cyclone III device family optimizations for low power and high integration to streamline development for volume products.

Why Choose EP3C25F324C7?

The EP3C25F324C7 offers a pragmatic combination of logic capacity, embedded memory and a high I/O count in a compact 324‑BGA footprint—well suited to mid‑range, cost‑sensitive FPGA deployments. Its low‑voltage core and family‑level low‑power process optimizations make it a fit where power budgets matter, while onboard resources reduce external component count and simplify PCB design.

This part is appropriate for engineers and procurement teams targeting scalable, commercial‑grade designs that benefit from the Cyclone III architecture, including integrated clock management and broad I/O capability. It provides a reliable platform for designs that require moderate logic density, accessible on‑chip memory and extensive I/O in a surface‑mount BGA package.

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