EP3C25F324I7

The EP3C25F324I7 is a Cyclone® III field programmable gate array (FPGA) in a 324-ball BGA package designed for industrial applications requiring a balance of functionality, integration and low power. It combines a dense logic fabric with on-chip RAM and a high I/O count to support embedded control, interface consolidation and system-level integration.

As part of the Cyclone III device family, this device leverages low-power process technology and silicon optimizations to reduce static power consumption while providing features for clock management and system reliability.

Key Features

• Logic Capacity — 24,624 logic elements provide substantial combinational and sequential logic resources for glue logic, protocol handling and custom processing.
• Embedded Memory — Approximately 0.61 Mbits of on-chip RAM (608,256 bits) for buffering, FIFO and small data storage needs without external memory.
• I/O Density — 215 user I/Os to support multiple peripheral interfaces, parallel buses and mixed-signal front-ends.
• Clock Management — Four phase-locked loops (PLLs) per device with multiple outputs for flexible clock synthesis and low-jitter distribution.
• Low-Voltage Operation — Core supply range of 1.15 V to 1.25 V consistent with low-power FPGA operation.
• Package and Mounting — 324-ball FBGA (19×19) surface-mount package for compact board-level integration.
• Industrial Temperature Range — Rated for operation from −40°C to 100°C to meet common industrial environment requirements.
• System Reliability — Family-level features include circuitry for error detection and mechanisms that support robust configuration and runtime monitoring.
• Standards and Compliance — RoHS compliant for environmentally conscious manufacturing.

Typical Applications

• Industrial Control — Embedded logic and abundant I/Os enable motor control, PLC peripherals and real-time I/O aggregation in industrial automation systems.
• Communications & Networking — High I/O count and programmable clocking make the device suitable for protocol bridging, packet buffering and interface adaptation.
• Consumer & Embedded Systems — On-chip RAM and logic density support display controllers, user interface processing and sensor aggregation in low-power designs.
• Instrumention & Test Equipment — Flexible I/O and deterministic logic resources allow implementation of custom measurement logic and timing-critical data paths.

Unique Advantages

• Highly Integrated Logic and Memory: Combines 24,624 logic elements with approximately 0.61 Mbits of embedded RAM to reduce external component count.
• Flexible I/O and Clocking: 215 I/Os and four PLLs provide the routing and timing resources needed for complex interface and timing designs.
• Low-Voltage, Low-Power Operation: Operates at a 1.15–1.25 V core supply range and benefits from family-level low-power process optimizations.
• Compact Surface-Mount Package: 324-FBGA (19×19) package enables high-density PCB layouts while supporting robust thermal and electrical connections.
• Designed for Industrial Environments: Rated for −40°C to 100°C operation and RoHS compliant for industrial deployments.
• Family Ecosystem: Part of the Cyclone III device family, which includes features for clock management, system reliability and embedded processing support.

Why Choose EP3C25F324I7?

The EP3C25F324I7 is positioned for engineers who need a low-power, industrial-grade FPGA with a strong balance of logic capacity, embedded memory and high I/O count in a compact BGA footprint. Its combination of programmable logic, on-chip RAM and flexible clocking makes it suitable for consolidating interfaces and implementing custom control logic while minimizing external components.

For projects that require industrial temperature operation, a surface-mount 324-FBGA package and RoHS compliance, the EP3C25F324I7 provides a practical platform with the Cyclone III family ecosystem and design features to support scalable, production designs.

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