EP3C25F324C7N

The EP3C25F324C7N is a Cyclone III family FPGA offering mid-range logic capacity and on-chip memory in a compact 324-BGA package. It is designed for high-volume, low-power, cost-sensitive applications where flexible I/O and integrated clock management are required.

Built on the Cyclone III device family architecture, this device combines low-power operation with a rich set of system features drawn from the family handbook, delivering the integration and efficiency needed for portable, consumer, and general-purpose embedded systems.

Key Features

• Logic Capacity  24,624 logic elements for mid-range digital integration and custom logic implementation.
• Embedded Memory  Approximately 0.61 Mbits of embedded memory (608,256 total RAM bits) to support buffering, FIFOs, and on-chip data storage.
• I/O Count and Flexibility  215 user I/O pins to support complex interfaces and multiple peripheral connections.
• Power Supply and Low-Power Design  Core voltage range 1.15 V to 1.25 V; Cyclone III family features emphasize low-power process technology and power-aware design flow to minimize static power.
• Clock Management  Family-level clock resources include multiple PLLs and flexible clocking options for system and interface timing (as described in Cyclone III device documentation).
• Package and Mounting  324-BGA (supplier package: 324-FBGA, 19×19) in a surface-mount form factor for compact PCB integration.
• Operating Conditions  Commercial grade device rated for 0 °C to 85 °C operation.
• RoHS Compliance  RoHS compliant to meet environmental requirements.

Typical Applications

• Portable and Handheld Devices  Low-power Cyclone III family characteristics and compact packaging help extend battery life and reduce cooling requirements in portable designs.
• Consumer Electronics  Mid-range logic capacity and ample I/O enable interface control, user interface management, and data buffering in consumer products.
• Embedded System Integration  On-chip memory and programmable logic provide flexibility for custom peripherals, protocol bridging, and system glue logic in embedded platforms.
• I/O-Heavy Applications  With 215 I/Os, the device suits designs that require multiple parallel interfaces or mixed-signal connections at the board level.

Unique Advantages

• Highly Integrated Mid-Range Logic  24,624 logic elements and embedded memory reduce external component count and simplify board-level design.
• Compact, PCB-Friendly Package  324-BGA (19×19 FBGA) provides a small footprint for space-constrained designs while supporting high pin count.
• Optimized for Low Power  Core voltage range and Cyclone III family low-power process help minimize static power for battery-operated and thermally constrained systems.
• Extensive I/O Resources  215 I/Os enable diverse peripheral connectivity and complex interface implementations without external multiplexers.
• Commercial Temperature Range  Rated for 0 °C to 85 °C operation to match typical consumer and general-purpose electronics environments.
• Standards and Compliance  RoHS compliance supports environmental and regulatory requirements for mainstream product lines.

Why Choose EP3C25F324C7N?

The EP3C25F324C7N positions itself as a practical solution for designers who need mid-range programmable logic with substantial I/O and on-chip memory in a compact BGA package. Its Cyclone III family heritage emphasizes low-power operation and system-level integration, making it suitable for cost-sensitive and portable designs that require flexible interfacing and reliable performance within commercial temperature limits.

Engineers can leverage the Cyclone III device family documentation and available ecosystem resources for clock management and IP integration to accelerate development and scale designs across similar family members.

Request a quote or submit a pricing inquiry today to check availability and get lead-time information for EP3C25F324C7N.