EP3C25U256C6

The EP3C25U256C6 is a Cyclone® III family Field Programmable Gate Array (FPGA) optimized for low-power, cost-sensitive designs. This device combines 24,624 logic elements with approximately 0.6 Mbits of embedded memory and 156 user I/Os in a compact 256‑LFBGA (14 × 14 mm UBGA) surface‑mount package.

Targeted at commercial applications, the device delivers a balance of integration and energy efficiency for mid-density logic, memory-intensive glue logic, and flexible I/O interfacing in systems that operate from a 1.15 V to 1.25 V core supply and within a 0 °C to 85 °C operating range.

Key Features

• Logic Capacity — 24,624 logic elements provide mid-range programmable logic resources suitable for complex glue logic, protocol bridging, and control functions.
• Embedded Memory — Approximately 0.6 Mbits of on‑chip RAM to support buffering, small FIFOs, and state storage without external memory.
• I/O Count & Flexibility — 156 user I/Os for broad connectivity to sensors, memory, high‑speed peripherals, and board-level interfaces.
• Low‑Voltage Core — Operates from a 1.15 V to 1.25 V core supply for compatibility with low‑power system designs.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial applications.
• Package & Mounting — 256‑LFBGA (256‑UBGA, 14×14 mm) surface‑mount package for compact PCB layouts and high‑density system integration.
• RoHS Compliant — Meets RoHS environmental requirements for lead‑free assembly.
• Cyclone III Family Features — Family-level capabilities include low‑power TSMC LP process optimizations, multiple PLLs for clock management, a high memory‑to‑logic ratio, and support for a wide range of I/O standards and system integration features as documented in the Cyclone III device handbook.

Typical Applications

• Embedded Control & Glue Logic — Implement board‑level control, protocol bridging, and custom state machines where mid‑density logic and moderate embedded RAM suffice.
• Industrial Automation Interfaces — Provide flexible I/O and buffering for sensor aggregation, motor/actuator control interfaces, and deterministic logic functions within commercial temperature ranges.
• Communications & Data Aggregation — Handle parallel data paths, packet buffering, and interface conversion using onboard RAM and abundant I/Os.
• Consumer & Portable Devices — Integrate custom logic and peripheral interfaces with a low‑power core supply suitable for battery‑sensitive designs.

Unique Advantages

• Mid‑Range Logic with On‑Chip Memory: 24,624 logic elements paired with approximately 0.6 Mbits of embedded RAM reduce reliance on external memory and simplify board design.
• High I/O Density: 156 user I/Os enable direct interfacing to multiple peripherals and bus systems, minimizing additional interface ICs.
• Compact BGA Package: 256‑LFBGA (14×14 mm) provides a small footprint for space-constrained PCBs while supporting surface‑mount assembly.
• Low‑Voltage Operation: 1.15 V to 1.25 V core supply supports energy‑efficient system architectures.
• Proven Family Feature Set: Benefits from Cyclone III family capabilities—low‑power process, PLL‑based clock management, and a strong IP ecosystem—documented in the device handbook.

Why Choose EP3C25U256C6?

The EP3C25U256C6 combines a practical balance of logic density, embedded memory, and I/O capacity in a compact, RoHS‑compliant BGA package for commercial applications. Its low‑voltage core and Cyclone III family characteristics make it well suited for designers seeking mid‑range programmable logic with on‑chip resources that simplify board-level integration and reduce BOM complexity.

This device is a fit for teams implementing control logic, interface consolidation, and moderate buffering tasks who require predictable commercial temperature operation and the documented family features found in the Cyclone III device handbook.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the EP3C25U256C6.