EP3C25E144C7

IC FPGA 82 I/O 144EQFP
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 82 608256 24624 144-LQFP Exposed Pad

Quantity 1,788 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package144-EQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFP Exposed PadNumber of I/O82Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1539Number of Logic Elements/Cells24624
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits608256

Overview of EP3C25E144C7 – Cyclone® III FPGA, 24,624 logic elements, 144-LQFP Exposed Pad

The EP3C25E144C7 is a Cyclone® III family Field Programmable Gate Array (FPGA) IC offering a balance of logic density, on-chip memory, and low-power operation for cost-sensitive, high-volume designs. Built on the Cyclone III device family architecture, it targets applications that require flexible I/O, moderate embedded memory, and efficient clock management while maintaining a commercial temperature grade.

Key value propositions include a dense logic fabric (24,624 logic elements), approximately 0.61 Mbits of embedded memory, and family-level low-power optimizations suited to designs where power, integration, and board-level I/O are important.

Key Features

  • Logic Density — 24,624 logic elements provide substantial programmable logic resources for mid-range FPGA designs.
  • Embedded Memory — Approximately 0.61 Mbits (608,256 bits) of on-chip RAM to support buffering, small data structures, and state storage.
  • I/O Capacity & Signal Integrity — 82 user I/O pins with family features such as adjustable I/O slew rates and multi-value on-chip termination (OCT) calibration to help maintain signal integrity across PVT conditions.
  • Clock Management — Cyclone III family clocking capabilities including four phase-locked loops (PLLs) per device and multiple PLL outputs to support robust clock synthesis and distribution.
  • Low-Power Architecture — Part of the Cyclone III family engineered with low-power process technology and design techniques to reduce static power consumption for battery-powered or thermally constrained systems.
  • Power Supply & Operating Range — Core voltage range of 1.15 V to 1.25 V; commercial operating temperature from 0 °C to 85 °C.
  • Package & Mounting — 144-LQFP Exposed Pad package; supplier device package listed as 144-EQFP (20×20). Surface-mount mounting type simplifies PCB assembly and thermal conduction via exposed pad.
  • Compliance — RoHS compliant for regulatory and manufacturing alignment.

Typical Applications

  • Consumer and Portable Electronics — Implement control logic, interface bridging, and custom peripherals where low-power operation and moderate logic density are required.
  • Communications and Networking — Use for protocol bridging, packet buffering, and custom I/O adaptation leveraging the device’s PLL-based clock management and I/O flexibility.
  • Industrial Control — Integrate motor control logic, sensor interfacing, and machine-state control in systems operating within commercial temperature ranges.
  • Embedded Systems — Realize application-specific accelerators, glue logic, and compact system controllers that benefit from on-chip memory and dense logic resources.

Unique Advantages

  • Highly integrated logic and memory: 24,624 logic elements combined with approximately 0.61 Mbits of embedded RAM reduce external component count and simplify board design.
  • Power-conscious family architecture: Cyclone III’s low-power process and device-level optimizations help lower static power for thermally or battery-constrained products.
  • Flexible clocking: Multiple PLLs and reconfigurable outputs enable robust clock domain creation and management without external clock-conditioning hardware.
  • I/O versatility and signal integrity tools: Adjustable slew rates and OCT calibration support a wide range of signaling needs while helping to maintain signal quality across varying conditions.
  • Compact, manufacturable package: 144-LQFP Exposed Pad with surface-mount mounting supports streamlined PCB assembly and improved thermal path through the exposed pad.
  • Regulatory readiness: RoHS compliance aligns with standard manufacturing and environmental requirements.

Why Choose EP3C25E144C7?

The EP3C25E144C7 places Cyclone III family capabilities—significant logic resources, embedded memory, flexible I/O, and family-level low-power design—into a compact 144-LQFP Exposed Pad package. It is well suited for designers building mid-range FPGA-based systems that need a balance of integration, power efficiency, and I/O capability within a commercial temperature range.

Support from the Cyclone III device family resources and documentation helps accelerate development, integration of pre-built IP, and system validation, making this device a practical choice for cost-sensitive, high-volume designs that require dependable programmable logic functionality.

Request a quote or submit an inquiry to receive pricing and availability information for EP3C25E144C7.

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