EP3C16U484I7

IC FPGA 346 I/O 484UBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 346 516096 15408 484-FBGA

Quantity 581 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-FBGANumber of I/O346Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs963Number of Logic Elements/Cells15408
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits516096

Overview of EP3C16U484I7 – Cyclone® III FPGA, 15,408 logic elements, 484‑FBGA

The EP3C16U484I7 is a Cyclone® III field-programmable gate array (FPGA) offered in a 484‑FBGA (19×19) surface-mount package and specified for industrial temperature operation. It delivers a balance of moderate logic density and embedded memory with a focus on low-power operation and system integration for cost- and power-sensitive designs.

Targeted for applications that require flexible I/O, on-chip memory, and reliable operation across −40 °C to 100 °C, this Cyclone III device is suited to mid-range embedded and control systems where integration and power efficiency matter.

Key Features

  • Logic Capacity — 15,408 logic elements provide programmable resources for custom digital logic, control, and glue-logic implementations.
  • Embedded Memory — Approximately 0.5 Mbits (516,096 bits) of on-chip RAM to support buffers, FIFOs, and small local storage without external memory.
  • I/O Resources — 346 user I/Os for high pin-count interfacing to sensors, peripherals, and external buses.
  • Voltage Supply — Core supply range from 1.15 V to 1.25 V for core power rails.
  • Clock Management — Cyclone III family clocking architecture (including multiple PLLs) enables robust clock synthesis and management for system and interface clocks.
  • Package & Mounting — 484‑FBGA (484‑UBGA, 19×19) in a surface-mount form factor suitable for compact PCB layouts.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
  • Standards & I/O Flexibility — Cyclone III family supports a broad set of I/O standards to accommodate diverse interface requirements.
  • Regulatory — RoHS compliant for environmental and manufacturing requirements.

Typical Applications

  • Portable and Handheld Electronics — Low-power family characteristics help extend battery life while providing embedded memory and logic for user interfaces and control functions.
  • Industrial Control — Industrial temperature rating and abundant I/Os support motor control, sensor interfacing, and on-site automation tasks.
  • Communications and Networking — Flexible I/O and on-chip clock management simplify protocol bridging, timing, and interface logic for mid-range communications equipment.
  • Embedded Processing and Custom IP — Sufficient logic and memory to implement custom peripherals, glue logic, and embedded soft processors available for Cyclone III devices.

Unique Advantages

  • Balanced Logic and Memory: 15,408 logic elements paired with approximately 0.5 Mbits of embedded RAM allow integration of control logic and local buffering without external components.
  • High I/O Count: 346 I/Os provide the pin density needed for multiple interfaces, sensors, and external devices, reducing the need for external multiplexers or expanders.
  • Industrial Reliability: Specified for −40 °C to 100 °C operation and delivered in a robust 484‑FBGA surface-mount package for industrial application boards.
  • Low-Power Family Foundation: Built on the Cyclone III device family architecture designed for low power, helping simplify thermal design and extend system battery life where applicable.
  • Flexible Clocking: Family-level PLL resources support robust clock synthesis and distribution for complex timing and multi-domain systems.
  • Compliance and Assembly: RoHS compliance and standard surface-mount FBGA packaging streamline modern manufacturing and environmental requirements.

Why Choose EP3C16U484I7?

The EP3C16U484I7 delivers a practical mix of logic density, embedded memory, and I/O capacity in an industrial-grade Cyclone III FPGA package. Its specifications make it a fit for mid-range embedded designs that require on-chip RAM, significant I/O, and reliable operation across a wide temperature range while leveraging the Cyclone III family’s low-power and system-integration capabilities.

Designers seeking a cost-sensitive, power-aware FPGA with the ecosystem and architecture of the Cyclone III family can use this device to consolidate functions, reduce external components, and accelerate development with available family-level IP and design flows.

Request a quote for EP3C16U484I7 to check current pricing and availability or submit a purchase inquiry through your preferred distributor or procurement channel.

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