EP3C16U484C6N

The EP3C16U484C6N is a Cyclone® III field programmable gate array (FPGA) in a 484-FBGA package designed for commercial applications that demand a balance of integration, low power and cost efficiency. It combines 15,408 logic elements (LEs) with 516,096 bits of on-chip RAM and 346 general-purpose I/O pins to address mid-range embedded and high-volume designs.

With a nominal core supply range of 1.15 V to 1.25 V, surface-mount 484-UBGA (19×19) packaging, and a 0 °C to 85 °C operating range, this device is suitable for compact, power-aware systems where on-chip memory, I/O density and programmable logic capacity are key design drivers.

Key Features

• Logic Capacity  963 configurable logic blocks (CLBs) providing 15,408 logic elements to implement custom digital functions and control logic.
• Embedded Memory  516,096 bits of on-chip RAM (approximately 0.5 Mbits) for data storage, buffering and state retention without external memory.
• I/O Density  346 user I/O pins to support multiple peripheral interfaces, parallel buses and high-pin-count system connectivity.
• Low‑Voltage Core  Core voltage supply range of 1.15 V to 1.25 V to support low-power system designs.
• Clock Management  Cyclone III family devices include integrated clock management resources such as phase-locked loops (PLLs) for synthesis and distribution of system clocks.
• Package & Mounting  484-FBGA (supplier package: 484-UBGA, 19×19) surface-mount package for high-density PCB implementations.
• Commercial Grade  Specified for operation from 0 °C to 85 °C for mainstream commercial applications.
• Standards & Compliance  RoHS compliant, supporting regulated manufacturing and assembly processes.

Typical Applications

• Portable and Battery-Powered Devices  Low-voltage core and family-level low-power optimizations make the device appropriate for compact, energy-conscious products requiring programmable logic.
• Consumer Electronics  On-chip RAM and abundant I/O enable display controllers, bridging logic and custom user-interface functions in consumer systems.
• Communications and I/O‑Rich Systems  High I/O count supports protocol bridging, interface conversion and mid-range data path handling in communications equipment.
• Embedded Control and Processing  Logic density and embedded memory support custom control logic, peripheral aggregation, and integration with soft-processor IP available for the Cyclone III family.

Unique Advantages

• Balanced Logic and Memory:  15,408 logic elements paired with approximately 0.5 Mbits of on-chip RAM reduces dependence on external memory and simplifies board design.
• High I/O Integration:  346 I/Os consolidate multiple interfaces on a single device, lowering BOM and PCB complexity for I/O‑constrained designs.
• Low‑Voltage Operation:  1.15 V–1.25 V core supply supports efficient power budgeting in compact systems.
• Compact, Surface‑Mount Package:  484-FBGA (19×19) package enables dense board layouts and is suitable for space-constrained products.
• Commercial Temperature Range:  Specified 0 °C to 85 °C operation aligns with mainstream electronics and consumer product requirements.
• RoHS Compliant:  Manufacturing and environmental compliance for regulated assembly and distribution.

Why Choose EP3C16U484C6N?

The EP3C16U484C6N positions Cyclone® III FPGA capability into a compact, low‑voltage package that meets the needs of mid-range embedded and high-volume commercial designs. Its combination of 15,408 logic elements, substantial on-chip RAM and 346 I/Os provides designers with a flexible platform to consolidate functions, reduce external components and accelerate time to market.

Backed by Cyclone III family resources and IP, this device is a practical choice for teams developing power-aware, I/O-dense systems that require validated FPGA building blocks and a predictable commercial temperature specification.

Request a quote or submit a pricing and availability inquiry to begin integrating the EP3C16U484C6N into your next design.