EP3C16U256C7

The EP3C16U256C7 is a Cyclone® III field-programmable gate array (FPGA) in a 256‑LFBGA package from Intel. It delivers a mid-range integration point with 15,408 logic elements and approximately 0.5 Mbits of embedded memory, suited for cost- and power-sensitive applications.

Designed for surface-mount implementation, this commercial-grade device (0 °C to 85 °C) offers a balance of logic capacity, on-chip memory, and I/O density for embedded control, communications interfaces, and general-purpose FPGA tasks where low power and high integration are priorities.

Key Features

• Logic Capacity — 15,408 logic elements to implement moderate-complexity digital logic, state machines, and custom hardware accelerators.
• Embedded Memory — Approximately 0.5 Mbits of on-chip RAM for buffering, FIFOs, and small data tables to support system logic without external memory.
• I/O Density — 168 user I/O pins, enabling multiple parallel interfaces and flexible board-level connectivity.
• Supply Voltage — Core supply range of 1.15 V to 1.25 V to match low-power system rails and power budgets.
• Clock Management (Family Feature) — Cyclone III family devices provide robust clock management, including multiple PLLs for clock synthesis and distribution within the FPGA.
• Embedded Processor Support (Family Feature) — Supports Nios II soft processor IP for embedded control and system integration on Cyclone III devices.
• Package & Mounting — 256‑LFBGA package (256‑UBGA, 14 × 14 mm footprint) in a surface-mount form factor for compact board designs.
• Operating Conditions & Grade — Commercial operating range of 0 °C to 85 °C; RoHS compliant.

Typical Applications

• Embedded Control — Implement control logic, state machines, and custom peripherals for embedded products that require moderate logic and memory capacity.
• Communications Interfaces — Implement protocol bridging, parallel interfaces, and timing-critical I/O processing using the device’s plentiful I/O and clock management features.
• Sensor & Data Aggregation — Aggregate and preprocess sensor data using on-chip RAM for buffering and FPGA logic for deterministic throughput.
• Prototyping & Low-Power Designs — Use as a development platform or production device where a low-power Cyclone III family solution and a compact BGA package are desirable.

Unique Advantages

• Balanced Logic and Memory: 15,408 logic elements paired with approximately 0.5 Mbits of embedded RAM to implement mid-range designs without immediate dependence on external memory.
• High I/O Count: 168 user I/Os allow flexible interfacing to peripherals, sensors, and parallel buses while simplifying system partitioning.
• Low-Voltage Core: Narrow core supply window (1.15 V–1.25 V) helps systems optimize power delivery and thermal profile.
• Compact Surface-Mount Package: 256‑LFBGA (14 × 14 mm UBGA footprint) enables dense board layouts for small form-factor applications.
• Commercial Temperature Range: Rated 0 °C to 85 °C, making it suitable for a broad set of consumer and commercial electronic applications.
• RoHS Compliant: Conforms to RoHS requirements for environmentally conscious designs and global supply chains.

Why Choose EP3C16U256C7?

The EP3C16U256C7 positions itself as a practical Cyclone III family FPGA for engineers who need a mid-range logic resource, on-chip memory, and a robust set of I/O in a compact surface-mount package. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of consumer and commercial deployments where power efficiency and integration matter.

Choose this device when your design requires balanced logic capacity, reliable on-chip RAM, and ample I/O in a BGA package—backed by the Cyclone III family ecosystem and available FPGA IP cores for accelerated development.

Request a quote or submit an inquiry to receive pricing and availability for the EP3C16U256C7. Our team will provide the information you need to move your design forward.