EP3C16U256C6N

IC FPGA 168 I/O 256UBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 168 516096 15408 256-LFBGA

Quantity 538 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package256-UBGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGANumber of I/O168Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs963Number of Logic Elements/Cells15408
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits516096

Overview of EP3C16U256C6N – Cyclone® III FPGA, 15,408 logic elements, 168 I/O, 256-LFBGA

The EP3C16U256C6N is a Cyclone® III field-programmable gate array (FPGA) offered in a 256-ball LFBGA package for surface-mount applications. It delivers a mid-range logic capacity with 15,408 logic elements and approximately 0.5 Mbits of embedded memory, making it suited for cost- and power-sensitive designs where integration and flexible I/O are important.

Targeted market segments include communications, consumer electronics, industrial control (commercial-grade), and general embedded systems that require reconfigurable logic, programmable interfacing, and moderate on-chip memory.

Key Features

  • Logic Capacity  Provides 15,408 logic elements for implementing combinational and sequential logic, state machines, and custom datapaths.
  • Embedded Memory  Approximately 0.5 Mbits of on-chip RAM to support buffering, FIFOs, and small data tables without external memory.
  • I/O Resources  168 user I/Os available in the 256-LFBGA package to support diverse peripheral and bus interfaces.
  • Power Supply  Operates from a core supply range of 1.15 V to 1.25 V, consistent with low-power Cyclone III family characteristics.
  • Package & Mounting  256-LFBGA (256-UBGA, 14×14) package optimized for surface-mount assembly and compact board layouts.
  • Operating Conditions  Commercial temperature grade with an operating range of 0 °C to 85 °C and RoHS compliance for environmental compatibility.
  • Cyclone III Family Capabilities  As a Cyclone III device, it benefits from family-level features such as low-power silicon optimizations, multiple phase-locked loops (PLLs) for clock management, support for a wide collection of I/O standards, and on-chip system integration elements documented in the Cyclone III device handbook.

Typical Applications

  • Embedded Control & Glue Logic  Implement custom control sequences, protocol bridging, and glue logic between processors and peripherals using the device’s logic resources and abundant I/Os.
  • Consumer & Portable Electronics  Enable configurable interfaces and moderate data buffering with low static power characteristics suitable for cost-sensitive consumer products.
  • Communications Interfaces  Support protocol adaptation, data framing, and I/O serialization tasks leveraging on-chip memory and programmable I/O.
  • Prototyping & Custom IP Integration  Deploy and iterate hardware accelerators, custom peripherals, and soft processors using the device’s logic and family-level IP availability.

Unique Advantages

  • Balanced Logic and Memory:  15,408 logic elements with approximately 0.5 Mbits of embedded RAM provides a practical balance for mid-range designs without immediate need for external memory.
  • Flexible I/O Count:  168 I/Os in a compact 256-LFBGA package let you route multiple interfaces while conserving board area.
  • Low-Power Family Design:  Built on the Cyclone III low-power architecture, the device supports power-aware designs that help manage static power in constrained systems.
  • Clock and System Management:  Family-level features such as multiple PLLs and clock synthesis support robust timing strategies and flexible clocking architectures for complex designs.
  • Commercial-Grade Reliability:  Rated for 0 °C to 85 °C operation and RoHS compliant, suitable for standard commercial embedded applications.

Why Choose EP3C16U256C6N?

The EP3C16U256C6N positions itself as a practical, mid-range Cyclone III FPGA option for engineers seeking a balance of logic capacity, embedded memory, and a high I/O count in a compact surface-mount package. Its core voltage range and family-level low-power features make it appropriate for cost- and power-conscious designs in communications, consumer, and general embedded systems.

Choose this part when you need reconfigurable logic with integrated memory and flexible interfacing, backed by the Cyclone III device family architecture and the documentation available in the Cyclone III device handbook.

Request a quote or submit an inquiry to receive pricing and availability information for the EP3C16U256C6N and to discuss how it can fit into your next design.

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