EP3C16F484C7
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 346 516096 15408 484-BGA |
|---|---|
| Quantity | 1,079 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 346 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 963 | Number of Logic Elements/Cells | 15408 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 516096 |
Overview of EP3C16F484C7 – Cyclone III FPGA, 15,408 logic elements, 346 I/Os, 484-BGA
The EP3C16F484C7 is an Intel Cyclone® III field-programmable gate array supplied in a 484-ball FBGA (23×23) package. It delivers a mid-range combination of programmable logic, on-chip memory, and high I/O count targeted at cost- and power-sensitive commercial designs.
Built on the Cyclone III device family architecture, this device is suited for applications that require flexible logic capacity (15,408 logic elements), approximately 0.5 Mbits of embedded memory, and up to 346 user I/Os while operating within a 1.15 V–1.25 V core supply window and a commercial temperature range (0 °C to 85 °C).
Key Features
- Logic Capacity — 15,408 logic elements for implementing combinational and sequential logic, state machines, and control functions.
- Embedded Memory — Approximately 0.5 Mbits of on-chip RAM to support buffering, lookup tables, and small data structures without external memory.
- I/O Resources — 346 user I/O pins to support multiple parallel interfaces, high-pin-count peripherals, or board-level signal routing.
- Power and Supply — Core supply range of 1.15 V to 1.25 V, reflecting the device’s low-power family heritage.
- Package & Mounting — 484-FBGA (23×23) surface-mount package for compact board integration and high-density routing.
- Operating Range & Grade — Commercial grade with operating temperature from 0 °C to 85 °C.
- Compliance — RoHS-compliant manufacturing.
- Cyclone III Family Capabilities — Family-level features include low-power process technology, multiple PLLs for clock management, and a broad set of supported I/O standards (as described in the Cyclone III device family documentation).
Typical Applications
- High-volume consumer and commercial products — Use the device’s low-power family characteristics and logic density to implement control, glue logic, and feature integration in cost-sensitive designs.
- Interface bridging and protocol adaptation — High I/O count supports parallel interfaces and multiple serial/parallel bus conversions on a single FPGA.
- Embedded control and signal conditioning — On-chip RAM and logic resources provide local buffering and real-time processing for control loops and peripheral handling.
- System prototyping and integration — Mid-range logic capacity and flexible I/O make this device suitable for proof-of-concept systems and migrating discrete logic into a programmable device.
Unique Advantages
- Balanced logic and memory — The combination of 15,408 logic elements and ~0.5 Mbits of embedded memory enables compact implementations of control and data-path functions without immediate need for external RAM.
- High I/O density — 346 I/Os reduce the need for external interface chips and simplify PCB routing for multi-port designs.
- Compact surface-mount package — 484-FBGA (23×23) allows high-density board layouts while keeping a small PCB footprint.
- Low-voltage core operation — 1.15 V–1.25 V supply window aligns with low-power system designs and the Cyclone III family’s power-aware architecture.
- Commercial temperature suitability — Specified 0 °C to 85 °C range fits typical commercial product environments.
- RoHS-compliant — Meets common environmental and manufacturing requirements for modern electronics production.
Why Choose EP3C16F484C7?
The EP3C16F484C7 positions itself as a mid-range Cyclone III FPGA that balances programmable logic capacity, embedded memory, and abundant I/O in a compact BGA package. It is well suited for designers who need to consolidate discrete logic, implement interface bridging, or add flexible control and processing to commercial products where power and board area are important considerations.
Choosing this device provides access to the Cyclone III family architecture and ecosystem, enabling scalable development and straightforward migration within the family for projects that prioritize cost-effectiveness, low-power operation, and versatile I/O connectivity.
Request a quote or submit an inquiry to receive pricing and availability for EP3C16F484C7 and to discuss how this Cyclone III device can fit your design requirements.

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