EP3C16F256I7N

The EP3C16F256I7N is an Intel Cyclone® III family FPGA device designed for low-power, cost-sensitive applications that require mid-range logic capacity and flexible I/O. Based on the Cyclone III device family architecture, this industrial-grade surface-mount FPGA combines 15,408 logic elements with approximately 0.5 Mbits of embedded memory and 168 user I/Os to address control, interface, and signal-processing tasks in embedded and industrial systems.

Key Features

• Logic Capacity — 15,408 logic elements (LEs) provide the programmable fabric required for mid-range digital logic, state machines, and custom peripheral implementation.
• On‑Chip Memory — Approximately 0.5 Mbits of embedded RAM (516,096 bits) for buffering, FIFOs, and small data stores close to logic.
• I/O Resources — 168 general-purpose I/O pins to support multiple interfaces, parallel buses, and mixed I/O requirements on a single device.
• Clock Management — Cyclone III family features include up to four PLLs per device for clock distribution, phase and frequency management, and clock-domain crossings.
• Low‑Power Architecture — Family-level low-power design elements and process optimizations reduce static power consumption for battery- or thermally-constrained systems.
• Power Supply — Core operating voltage range of 1.15 V to 1.25 V for the device core.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Package and Mounting — 256-LBGA package (supplier packaging listed as 256-FBGA, 17×17); surface-mount mounting for standard PCB assembly processes.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Implement real-time control logic, interface bridging, and deterministic I/O handling within factory automation and process-control systems using its industrial temperature rating and ample I/O count.
• Embedded Systems — Host custom peripheral logic, state machines, and glue logic for embedded products where moderate logic density and on-chip RAM simplify board-level design.
• Data Acquisition & Signal Conditioning — Use the device’s I/O resources and embedded memory for sampling, buffering, and pre-processing sensor data before passing to a host processor.
• Communications Interfaces — Implement protocol bridging, parallel/serial interface aggregation, and timing adaptation leveraging the device’s PLLs and flexible I/O.

Unique Advantages

• Balanced Logic and Memory: 15,408 logic elements paired with approximately 0.5 Mbits of RAM enable moderate-complexity designs without external memory for many control and buffering tasks.
• High I/O Count: 168 user I/Os allow integration of multiple interfaces and peripherals on a single FPGA, reducing board-level glue logic and BOM complexity.
• Industrial Reliability: Specified −40 °C to 100 °C operation and surface-mount packaging make the device suitable for industrial deployments and ruggedized assemblies.
• Power-Efficient Family Architecture: Cyclone III family design choices target low static power, helping meet thermal budgets and lower system-level power consumption.
• Flexible Clocking: Multiple PLLs and family-level clock-management features simplify multi-domain clocking and reduce external clocking requirements.
• Standards-Friendly Packaging: 256-LBGA (256-FBGA, 17×17) footprint aligns with common PCB assembly workflows and dense board designs.

Why Choose EP3C16F256I7N?

The EP3C16F256I7N provides a practical balance of logic capacity, embedded memory, and I/O density within the Cyclone III FPGA family—targeted at mid-range embedded and industrial applications where power efficiency, configurability, and industrial temperature operation matter. Its combination of 15,408 logic elements, approximately 0.5 Mbits of on-chip RAM, 168 I/Os, and robust clocking features lets designers integrate control, interface, and preprocessing functions while simplifying board-level design.

This device is suited for customers developing cost- and power-sensitive designs that require a reliable, programmable solution with established family-level features and RoHS compliance. The EP3C16F256I7N supports straightforward scaling within Cyclone III devices and benefits from family documentation and design flows.

Request a quote or submit an RFQ to check availability, lead times, and pricing for the EP3C16F256I7N.