EP3C16F256C8N

The EP3C16F256C8N is an Intel Cyclone III family FPGA delivered in a 256‑ball L‑BGA package. It provides a mid‑range logic resource set and embedded memory suitable for cost‑sensitive, low‑power commercial designs that require flexible programmable logic and a high I/O count.

Built on the Cyclone III architecture, this device targets applications that require a balance of logic capacity, on‑chip RAM, and configurable I/O while operating within a commercial temperature range and low core voltage.

Key Features

• Logic Capacity — 15,408 logic elements enabling mid‑range custom logic implementations and glue‑logic consolidation.
• Embedded Memory — Approximately 0.5 Mbits (516,096 bits) of on‑chip RAM for buffering, FIFOs, and small data structures.
• I/O Resources — 168 I/O pins to support multiple peripheral interfaces, parallel buses, and mixed signal I/O arrangements.
• Low‑Voltage Core — Core supply range of 1.15 V to 1.25 V for compatibility with low‑power system rails.
• Package and Mounting — 256‑LBGA package (supplier device package: 256‑FBGA, 17×17) with surface mount construction for compact PCB implementation.
• Commercial Temperature Range — Rated for 0 °C to 85 °C suitable for consumer and commercial electronics.
• RoHS Compliant — Meets RoHS requirements for lead‑free assembly and environmental regulatory alignment.

Typical Applications

• Consumer Electronics — Custom control logic, protocol bridging, and peripheral interfacing where compact packaging and moderate logic count are needed.
• Communications & Networking — Line cards, protocol adapters, and control plane logic leveraging the device’s I/O density and embedded RAM for packet buffering.
• Test & Measurement — Custom timing, signal conditioning, and data aggregation logic that benefit from reprogrammable hardware and moderate memory resources.
• Prototyping and Development — Hardware proof‑of‑concept and system validation for mid‑range FPGA designs prior to volume deployment.

Unique Advantages

• Balanced Logic and Memory — 15,408 logic elements paired with ~0.5 Mbits of embedded RAM provide a versatile platform for combining control logic and data buffering on a single device.
• High I/O Count — 168 I/Os let you interface multiple peripherals and external devices without requiring external multiplexers or GPIO expanders.
• Compact, Surface‑Mount Packaging — The 256‑LBGA footprint supports space‑constrained PCB layouts while maintaining robust electrical connections for commercial assemblies.
• Low Core Voltage — 1.15 V to 1.25 V supply compatibility helps reduce system power and integrate with modern low‑voltage power rails.
• Ready for Commercial Designs — Rated for 0 °C to 85 °C and RoHS compliant, making it appropriate for consumer and commercial product lines.

Why Choose EP3C16F256C8N?

The EP3C16F256C8N delivers a practical combination of logic capacity, embedded memory, and high I/O count within a compact 256‑LBGA package, making it well suited for commercial products that require flexible programmable logic without excessive power or cost. Its low core voltage and RoHS compliance align with modern, energy‑conscious system designs.

This Cyclone III device is a solid choice for engineers developing consumer, communications, and test equipment applications who need a scalable, reprogrammable platform backed by the Cyclone III family feature set.

Request a quote or submit a purchase inquiry to receive pricing and availability information for EP3C16F256C8N. Our team can provide lead‑time details and support to help integrate this Cyclone III FPGA into your design.