EP3C16F256C7

The EP3C16F256C7 is a Cyclone® III field-programmable gate array (FPGA) in a 256-LBGA package from Intel. It provides 15,408 logic elements and approximately 0.5 Mbits of embedded memory, making it suitable for cost-sensitive, low-power designs that require moderate logic density and substantial I/O capability.

Built on the Cyclone III device family architecture, the device targets applications where low static power, flexible I/O support and integrated clock management are important. The device is supplied for commercial use and is RoHS compliant.

Key Features

• Logic Capacity — 15,408 logic elements for implementing mid-range logic functions and state machines.
• Embedded Memory — 516,096 bits of on-chip RAM (approximately 0.5 Mbits) for data buffering, FIFOs, and small memory structures.
• I/O Resources — 168 user I/Os to support multiple interfaces and board-level connectivity.
• Clock Management — Cyclone III family features include integrated phase-locked loops (PLLs) for robust clock synthesis and management.
• Low-Power Technology — Based on the Cyclone III family’s low-power process and silicon optimizations, designed for reduced static power consumption.
• Voltage Supply — Core supply range of 1.15 V to 1.25 V.
• Package and Mounting — 256-LBGA package; supplier package listed as 256-FBGA (17×17), surface-mount technology.
• Operating Range — Commercial operating temperature range 0 °C to 85 °C.
• Standards and I/O Support — Cyclone III family supports a wide range of I/O standards and on-chip termination features for signal integrity and interface flexibility.
• Compliance — RoHS compliant.

Typical Applications

• Portable and Handheld Systems — Low-power characteristics help extend battery life and enable compact, thermally efficient designs.
• Consumer and High-Volume Electronics — Cost-sensitive applications that require mid-range logic integration and flexible I/O options.
• I/O-Constrained Designs — Systems requiring many external interfaces benefit from the device’s 168 I/Os and I/O-standard support.
• Embedded Control and Signal Handling — On-chip memory and logic density support control tasks, data buffering, and moderate signal processing functions.

Unique Advantages

• Balanced Logic and Memory — 15,408 logic elements paired with approximately 0.5 Mbits of embedded memory provide a compact solution for mid-range integration needs.
• Extensive I/O Count — 168 I/Os enable direct interfacing to multiple peripherals and bus structures without extensive external glue logic.
• Integrated Clock Resources — Family-level PLL capabilities offer flexible clock synthesis and distribution for diverse system timing requirements.
• Low-Power Profile — Cyclone III low-power technology reduces static power, supporting battery-operated and thermally constrained designs.
• Commercial Temperature Rating — Rated 0 °C to 85 °C for typical commercial applications and environments.
• Compact Surface-Mount Package — 256-LBGA (256-FBGA 17×17) package balances board space and pin count for dense designs.

Why Choose EP3C16F256C7?

The EP3C16F256C7 delivers a mid-range FPGA option within the Cyclone III family that balances logic capacity, embedded memory and a high I/O count in a compact surface-mount package. Its low-power device architecture and integrated clock management features make it well suited for commercial, cost-sensitive applications that require efficient power use and versatile interfacing.

This device is appropriate for design teams seeking a commercially graded FPGA with documented Cyclone III family features and available device documentation for integration into volume and embedded designs.

Request a quote or submit an inquiry for pricing and availability of the EP3C16F256C7 to begin integrating this Cyclone III FPGA into your next design.