EP3C16E144I7N

The EP3C16E144I7N is an Intel Cyclone® III family FPGA in a 144-LQFP exposed pad package configured for surface-mount applications. It delivers a mid-range FPGA fabric with 15,408 logic elements and approximately 0.5 Mbits (516,096 bits) of embedded memory, suited to cost- and power-sensitive designs.

Built on the Cyclone III device family architecture, this device targets applications requiring a balance of integration, low power, and flexible I/O. Its industrial-grade temperature range and exposed-pad package support robust board-level integration in demanding environments.

Key Features

• Logic Capacity — 15,408 logic elements across 963 LABs, providing mid-range programmable logic for glue logic, protocol bridging, and control functions.
• On-chip Memory — Approximately 0.5 Mbits (516,096 bits) of embedded memory for FIFOs, buffering, and small on-chip data storage.
• I/O and Standards — 84 user I/O pins with support across the Cyclone III family for a wide collection of I/O standards and adjustable slew rates to improve signal integrity.
• Clock Management — Family-level support for up to four phase-locked loops (PLLs) per device for clock synthesis and management.
• Power Supply — Core voltage range specified at 1.15 V to 1.25 V to match Cyclone III power requirements.
• Thermal and Mechanical — Industrial operating temperature range of −40 °C to 100 °C and surface-mount 144-LQFP exposed pad package (supplier package: 144-EQFP 20×20) for effective thermal dissipation.
• Low-Power Family Characteristics — As part of the Cyclone III family, the device leverages low-power process technology and silicon optimizations to support low static power operation in cost-sensitive applications.
• Compliance — RoHS compliant for lead-free manufacturing flows.

Typical Applications

• Portable and Handheld Devices — Low-power family characteristics make the device suitable for battery-powered and thermally constrained systems.
• Industrial Control and Automation — Industrial temperature rating and flexible I/O enable sensor interfacing, motor control logic, and protocol bridging in factory equipment.
• Communications and Networking — Mid-range logic and on-chip memory support packet buffering, protocol conversion, and custom interfacing.
• Embedded Processing and System Glue — FPGA fabric and available Cyclone III family IP (including support for embedded processors) provide a platform for custom control, peripheral aggregation, and hardware-accelerated functions.

Unique Advantages

• Balanced Integration: 15,408 logic elements and 516,096 bits of embedded memory provide a compact FPGA solution for mid-range integration tasks, reducing external component count.
• Flexible I/O Support: 84 I/Os with adjustable slew rates and broad family support for multiple I/O standards ease board-level interface design.
• Industrial Reliability: −40 °C to 100 °C operating range and an exposed-pad 144-LQFP package facilitate reliable operation in industrial environments.
• Low-Power Operation: Based on Cyclone III low-power process technology and silicon optimizations, the device is suitable for cost-sensitive designs that prioritize power efficiency.
• Effective Clocking: Family-level availability of up to four PLLs enables robust clock domain management and synthesis for mixed-frequency systems.
• Regulatory Readiness: RoHS compliance supports lead-free manufacturing requirements.

Why Choose EP3C16E144I7N?

The EP3C16E144I7N combines mid-range programmable logic capacity, on-chip memory, and flexible I/O in an industrial-grade Cyclone III package. It is positioned for designers who need a cost- and power-conscious FPGA platform with the integration and clocking resources necessary for control, interface, and embedded tasks.

For engineering teams targeting portable, industrial, or communications applications, this device provides a scalable FPGA option within the Cyclone III family ecosystem, with family-level features and vendor documentation available to support development and deployment.

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