EP3C16E144I7
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 84 516096 15408 144-LQFP Exposed Pad |
|---|---|
| Quantity | 1,214 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-EQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP Exposed Pad | Number of I/O | 84 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 963 | Number of Logic Elements/Cells | 15408 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 516096 |
Overview of EP3C16E144I7 – Cyclone III FPGA, 15,408 logic elements, 84 I/Os, 144-LQFP
The EP3C16E144I7 is an Intel Cyclone® III family field programmable gate array (FPGA) in a 144-LQFP exposed-pad surface-mount package. It delivers 15,408 logic elements and approximately 0.516 Mbits of embedded memory, targeting high-volume, low-power and cost-sensitive designs.
Built around the Cyclone III device architecture, this device is suited for applications that require efficient logic integration, moderate on-chip memory, and flexible I/O in an industrial temperature range. Its value proposition centers on low power operation, system integration, and a compact package for space-constrained boards.
Key Features
- Core Logic – 15,408 logic elements provide substantial programmable logic capacity for mid-density designs.
- Embedded Memory – 516,096 bits of on-chip RAM (approximately 0.516 Mbits) for buffers, FIFOs, and small data stores.
- I/O – 84 user I/Os to support a variety of interfaces and board-level connectivity in I/O-constrained systems.
- Power – Core voltage supply range of 1.15 V to 1.25 V, and family-level low-power optimizations based on TSMC low-power process technology and power-aware design flow.
- Clock Management – Cyclone III family includes up to four PLLs per device (family feature) to support clock synthesis and distribution needs.
- Package & Mounting – 144-LQFP with exposed pad, surface-mount mounting for board-level thermal conduction and compact layouts (supplier package: 144-EQFP 20×20).
- Operating Range – Industrial-grade operation from −40 °C to 100 °C for deployment in thermally challenging environments.
- Compliance – RoHS compliant.
Typical Applications
- Portable and handheld devices – Low-power family attributes help extend battery life in compact, battery-operated designs.
- Industrial control and instrumentation – Industrial temperature rating and a compact 144-LQFP package suit rugged, space-constrained controllers and sensor interfaces.
- I/O-constrained system bridging – Mid-range logic and 84 I/Os provide flexible protocol bridging and interface glue logic for communication modules and peripherals.
- Field-upgradeable embedded systems – Family-level support for remote system upgrade capability enables in-field updates without an external controller.
Unique Advantages
- Efficient mid-range logic capacity: 15,408 logic elements balance functionality and cost for designs that need meaningful programmable logic without excess overhead.
- Meaningful on-chip memory: Approximately 0.516 Mbits of embedded RAM reduces dependence on external memory for small buffering and state storage.
- Low-power architecture: TSMC low-power process and power-aware design flow (family features) help reduce static power, aiding battery-powered and thermally-sensitive designs.
- Industrial temperature capability: −40 °C to 100 °C operation supports deployment in harsher environments where extended temperature tolerance is required.
- Compact, thermally aware package: 144-LQFP with exposed pad provides a surface-mount option that aids thermal conduction and efficient PCB integration in space-limited layouts.
- Flexible clock and system management: Family-level PLL resources and features such as on-chip termination calibration and SEU detection primitives improve system robustness and signal integrity.
Why Choose EP3C16E144I7?
The EP3C16E144I7 brings Cyclone III family benefits—low power operation, integrated clock management, and practical on-chip memory—into a compact 144-LQFP exposed-pad package. Its combination of 15,408 logic elements, approximately 0.516 Mbits of embedded RAM, and 84 I/Os makes it well suited for mid-density programmable logic tasks in industrial and portable applications.
For engineering teams and buyers seeking a balance of integration, thermal-friendly packaging, and family-level low-power features, this device provides a straightforward FPGA option that scales with common embedded and system-level needs while maintaining industrial temperature limits and RoHS compliance.
Request a quote or submit a procurement inquiry to receive pricing and availability for the EP3C16E144I7.

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