EP3C16E144C7

The EP3C16E144C7 is a Cyclone® III field programmable gate array (FPGA) in a 144-LQFP exposed pad surface-mount package. It delivers mid-range logic capacity and on-chip memory suited to cost- and power-sensitive embedded designs.

Built on the Cyclone III device family architecture, this device targets high-volume, low-power applications and offers integration options for system designers who require on-chip logic, embedded RAM, and flexible I/O in a compact commercial-grade package.

Key Features

• Logic Capacity — 15,408 logic elements providing mid-range programmable logic resources for control, interface, and signal processing functions.
• Embedded Memory — Approximately 0.516 Mbits of on-chip RAM for buffering, small lookup tables, and state storage.
• I/O — 84 user I/O pins to support a variety of peripheral interfaces and board-level connections.
• Power Supply — Core voltage range of 1.15 V to 1.25 V to match system power-rail requirements.
• Package and Mounting — 144-LQFP exposed pad package (supplier package: 144-EQFP, 20×20 mm) in a surface-mount form factor for compact board layouts and thermal relief via the exposed pad.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for standard commercial applications.
• RoHS Compliant — Meets RoHS requirements for lead-free manufacturing.
• Cyclone III Family Capabilities — Leverages family-level attributes such as low-power TSMC process technology, support for clock management with PLLs, and a broad set of I/O standards and termination/calibration features (as documented for the Cyclone III device family).

Typical Applications

• Battery-powered and handheld devices — Low-power Cyclone III family characteristics help extend battery life for portable electronics.
• Consumer and industrial control — On-chip logic and embedded RAM enable glue logic, state machines, and peripheral interfacing for control panels and appliances.
• Embedded processing and custom IP — Mid-range logic and memory support lightweight embedded soft-processor cores and custom accelerators in space-constrained designs.
• Interface bridging and protocol adaptation — Multiple I/Os and programmable logic density allow implementation of board-level interface conversion and protocol handling.

Unique Advantages

• Balanced logic and memory — 15,408 logic elements paired with approximately 0.516 Mbits of embedded RAM provide a practical balance for mid-range designs without excess overhead.
• Compact, assembly-friendly package — 144-LQFP exposed pad in a surface-mount format simplifies PCB routing while providing an exposed pad for thermal conduction.
• Flexible I/O count — 84 user I/Os enable direct connections to a wide variety of peripherals and external devices, reducing the need for external interface ICs.
• Commercial-grade operating range — 0 °C to 85 °C rating aligns with mainstream consumer and industrial control environments.
• Standards-compliant manufacturing — RoHS compliance supports modern, lead-free production flows.

Why Choose EP3C16E144C7?

The EP3C16E144C7 provides a practical, mid-density Cyclone III FPGA option for designers who need an efficient balance of logic, embedded memory, and I/O in a compact 144-LQFP package. Its family-level low-power optimizations and on-chip resources make it suitable for cost-sensitive, high-volume projects where power and board-space are important considerations.

This device is well suited to systems requiring moderate programmable logic capacity, straightforward thermal handling via an exposed pad package, and commercial-temperature operation—offering a scalable platform supported by Cyclone III device family documentation and toolchains.

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