EP3C120F780I7

The EP3C120F780I7 is an Intel Cyclone® III field-programmable gate array (FPGA) offered in a 780-ball FBGA package (29 × 29 mm). It delivers high logic capacity and embedded memory for cost- and power-sensitive designs across industrial applications.

Built on the Cyclone III device family architecture, this device pairs 119,088 logic elements with approximately 3.98 Mbits of embedded memory and 531 I/Os, making it suitable for mid-to-high density implementation where integration, I/O count, and low-power operation are important.

Key Features

• Logic Capacity — 119,088 logic elements provide substantial programmable logic resources for complex combinational and sequential designs; product data also lists 7,443 LABs/CLBs.
• Embedded Memory — Approximately 3.98 Mbits of on-chip RAM (3,981,312 bits) for buffers, FIFOs, and user memory needs without external RAM.
• I/O Density — 531 user I/O pins to support broad interfacing requirements and multiple parallel interfaces.
• Power Supply — Core voltage support from 1.15 V to 1.25 V to match system power domains and enable low-power operation consistent with Cyclone III family characteristics.
• Package & Mounting — 780-FBGA package (29 × 29 mm), surface-mount mounting for compact PCB integration and high I/O routing density.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial and temperature-challenging environments.
• Family-Level System Features — Cyclone III family emphasizes low power and integration; the family supports multiple I/O standards, phase-locked loops (PLLs) for clock management, and a high memory-to-logic ratio (as described in the Cyclone III device handbook).
• Compliance — RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• Industrial Control — High I/O count and industrial temperature rating allow implementation of motor control, PLC logic, and factory automation interfaces.
• Communications & Networking — Large logic and memory resources support packet processing, protocol bridging, and custom interface logic for mid-range networking equipment.
• Embedded Systems — Integrated memory and abundant logic elements enable system glue logic, hardware acceleration blocks, and on-chip controllers for embedded products.
• Test and Measurement — Flexible I/O and reprogrammability make the device suitable for signal processing front-ends, data acquisition, and custom instrumentation logic.

Unique Advantages

• High Integration Density: 119,088 logic elements combined with approximately 3.98 Mbits of embedded memory reduce the need for external components and lower BOM complexity.
• Broad I/O Support: 531 I/Os permit complex interfacing and parallel data paths without extensive external multiplexing.
• Industrial Reliability: Operation from −40 °C to 100 °C and surface-mount 780-FBGA package support rugged deployments and compact board designs.
• Low-Power Family Architecture: As part of the Cyclone III family, the device benefits from low-power process and power-aware design practices to help meet system power budgets.
• Scalable Clock Management: Family-level PLL features provide flexible clock synthesis and management for multi-domain designs (as described in Cyclone III documentation).

Why Choose EP3C120F780I7?

The EP3C120F780I7 positions itself as a high-capacity, industrial-grade Cyclone III FPGA suitable for engineers needing a balance of logic density, embedded memory, and extensive I/O in a compact FBGA package. Its core voltage range and family-level low-power characteristics help designers meet stringent power and thermal targets while maintaining system flexibility.

This device is well suited for teams developing industrial control systems, communications equipment, and embedded platforms that require on-chip memory, large programmable logic resources, and robust operating-temperature support, leveraging the Cyclone III device family’s ecosystem and documentation.

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