EP3C120F780C8
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 531 3981312 119088 780-BGA |
|---|---|
| Quantity | 164 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BGA | Number of I/O | 531 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7443 | Number of Logic Elements/Cells | 119088 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3981312 |
Overview of EP3C120F780C8 – Cyclone® III Field Programmable Gate Array, 119,088 logic elements, 780‑FBGA
The EP3C120F780C8 is a Cyclone® III family FPGA delivering 119,088 logic elements, approximately 3.98 Mbits of embedded memory, and 531 user I/Os in a 780‑FBGA (29×29) surface‑mount package. Built on the Cyclone III device architecture, it targets high‑volume, low‑power and cost‑sensitive applications that require dense logic, substantial on‑chip RAM and flexible I/O.
With a nominal core supply range of 1.15 V to 1.25 V and commercial operating temperature from 0 °C to 85 °C, this device offers a compact, RoHS‑compliant solution for designs that prioritize integration, power awareness, and system‑level IO flexibility.
Key Features
- Core Logic 119,088 logic elements provide high-density programmable logic for complex custom functions and hardware acceleration.
- Embedded Memory Approximately 3.98 Mbits of on‑chip RAM to support buffering, lookup tables and embedded data storage without external memory.
- I/O Capability 531 user I/Os support a broad range of interfaces and high pin count system integration in a single package.
- Power and Voltage Core supply range from 1.15 V to 1.25 V, aligning with the Cyclone III family focus on low‑power operation for battery‑sensitive or thermally constrained systems.
- Clock Management Family features include multiple phase‑locked loops (PLLs) for robust clock synthesis and distribution, enabling flexible frequency and phase control for system clocks and I/O interfaces.
- I/O Signal Integrity Cyclone III family support for adjustable I/O slew rates and a variety of I/O standards helps optimize signal integrity across mixed‑voltage designs.
- Package and Mounting 780‑FBGA (29×29) surface‑mount package provides high pin density in a compact footprint for space‑constrained PCBs.
- Commercial Grade & RoHS Commercial grade device with operating range 0 °C to 85 °C and RoHS compliance for standard commercial applications.
Typical Applications
- Embedded Processing and Acceleration Implement custom datapaths, hardware accelerators or offload functions from a host CPU using dense programmable logic and on‑chip memory.
- High‑Density I/O Bridging Bridge multiple peripherals and interfaces in systems that require many signals routed through a single programmable device.
- Memory‑Intensive Logic Use the approximately 3.98 Mbits of embedded RAM for buffering, packet handling or LUT‑based functions in communication and data acquisition designs.
- Low‑Power, Cost‑Sensitive Products Deploy in portable or high‑volume products where power efficiency and cost control are priorities, leveraging the Cyclone III family’s low‑power optimizations.
Unique Advantages
- High Logic Density: 119,088 logic elements reduce the need for multiple devices, simplifying board design and lowering BOM complexity.
- Substantial On‑Chip Memory: Approximately 3.98 Mbits of embedded RAM supports larger in‑FPGA datasets, reducing reliance on external memories.
- Large I/O Count: 531 I/Os enable direct connectivity to many peripherals and high‑pin‑count interfaces without external multiplexers.
- Compact, High‑Pin Package: 780‑FBGA (29×29) packaging delivers high integration in a small footprint, aiding compact system layouts.
- Power‑Aware Architecture: Family design and core voltage range support low static power operation, beneficial for thermally constrained or battery‑operated designs.
- Ecosystem and FPGA‑Level Functionality: Cyclone III family features—such as flexible PLLs, adjustable slew rates, and support for a variety of I/O standards—help accelerate system integration and reduce design iterations.
Why Choose EP3C120F780C8?
The EP3C120F780C8 positions itself as a high‑density, low‑power Cyclone III FPGA suitable for designers needing large programmable logic capacity, significant on‑chip memory, and a high I/O count in a compact surface‑mount package. Its commercial temperature range and RoHS compliance make it appropriate for mainstream embedded and consumer electronics applications.
Choose this device when your design demands a balanced combination of logic capacity, embedded RAM, and flexible I/O in a cost‑sensitive FPGA platform backed by Cyclone III family features for clock management and signal integrity control.
Request a quote or submit a pricing inquiry to get availability and lead‑time details for EP3C120F780C8.

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