EP3C120F780C8

IC FPGA 531 I/O 780FBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 531 3981312 119088 780-BGA

Quantity 164 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BGANumber of I/O531Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7443Number of Logic Elements/Cells119088
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3981312

Overview of EP3C120F780C8 – Cyclone® III Field Programmable Gate Array, 119,088 logic elements, 780‑FBGA

The EP3C120F780C8 is a Cyclone® III family FPGA delivering 119,088 logic elements, approximately 3.98 Mbits of embedded memory, and 531 user I/Os in a 780‑FBGA (29×29) surface‑mount package. Built on the Cyclone III device architecture, it targets high‑volume, low‑power and cost‑sensitive applications that require dense logic, substantial on‑chip RAM and flexible I/O.

With a nominal core supply range of 1.15 V to 1.25 V and commercial operating temperature from 0 °C to 85 °C, this device offers a compact, RoHS‑compliant solution for designs that prioritize integration, power awareness, and system‑level IO flexibility.

Key Features

  • Core Logic  119,088 logic elements provide high-density programmable logic for complex custom functions and hardware acceleration.
  • Embedded Memory  Approximately 3.98 Mbits of on‑chip RAM to support buffering, lookup tables and embedded data storage without external memory.
  • I/O Capability  531 user I/Os support a broad range of interfaces and high pin count system integration in a single package.
  • Power and Voltage  Core supply range from 1.15 V to 1.25 V, aligning with the Cyclone III family focus on low‑power operation for battery‑sensitive or thermally constrained systems.
  • Clock Management  Family features include multiple phase‑locked loops (PLLs) for robust clock synthesis and distribution, enabling flexible frequency and phase control for system clocks and I/O interfaces.
  • I/O Signal Integrity  Cyclone III family support for adjustable I/O slew rates and a variety of I/O standards helps optimize signal integrity across mixed‑voltage designs.
  • Package and Mounting  780‑FBGA (29×29) surface‑mount package provides high pin density in a compact footprint for space‑constrained PCBs.
  • Commercial Grade & RoHS  Commercial grade device with operating range 0 °C to 85 °C and RoHS compliance for standard commercial applications.

Typical Applications

  • Embedded Processing and Acceleration  Implement custom datapaths, hardware accelerators or offload functions from a host CPU using dense programmable logic and on‑chip memory.
  • High‑Density I/O Bridging  Bridge multiple peripherals and interfaces in systems that require many signals routed through a single programmable device.
  • Memory‑Intensive Logic  Use the approximately 3.98 Mbits of embedded RAM for buffering, packet handling or LUT‑based functions in communication and data acquisition designs.
  • Low‑Power, Cost‑Sensitive Products  Deploy in portable or high‑volume products where power efficiency and cost control are priorities, leveraging the Cyclone III family’s low‑power optimizations.

Unique Advantages

  • High Logic Density:  119,088 logic elements reduce the need for multiple devices, simplifying board design and lowering BOM complexity.
  • Substantial On‑Chip Memory:  Approximately 3.98 Mbits of embedded RAM supports larger in‑FPGA datasets, reducing reliance on external memories.
  • Large I/O Count:  531 I/Os enable direct connectivity to many peripherals and high‑pin‑count interfaces without external multiplexers.
  • Compact, High‑Pin Package:  780‑FBGA (29×29) packaging delivers high integration in a small footprint, aiding compact system layouts.
  • Power‑Aware Architecture:  Family design and core voltage range support low static power operation, beneficial for thermally constrained or battery‑operated designs.
  • Ecosystem and FPGA‑Level Functionality:  Cyclone III family features—such as flexible PLLs, adjustable slew rates, and support for a variety of I/O standards—help accelerate system integration and reduce design iterations.

Why Choose EP3C120F780C8?

The EP3C120F780C8 positions itself as a high‑density, low‑power Cyclone III FPGA suitable for designers needing large programmable logic capacity, significant on‑chip memory, and a high I/O count in a compact surface‑mount package. Its commercial temperature range and RoHS compliance make it appropriate for mainstream embedded and consumer electronics applications.

Choose this device when your design demands a balanced combination of logic capacity, embedded RAM, and flexible I/O in a cost‑sensitive FPGA platform backed by Cyclone III family features for clock management and signal integrity control.

Request a quote or submit a pricing inquiry to get availability and lead‑time details for EP3C120F780C8.

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