EP3C120F484I7
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 283 3981312 119088 484-BGA |
|---|---|
| Quantity | 77 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 283 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7443 | Number of Logic Elements/Cells | 119088 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3981312 |
Overview of EP3C120F484I7 – Cyclone® III FPGA, 119,088 logic elements, 484-BGA
The EP3C120F484I7 is an Intel Cyclone® III Field Programmable Gate Array (FPGA) provided in a 484-ball BGA package for surface-mount applications. It delivers a large logic capacity and embedded memory suited to high-volume, low-power, cost-sensitive designs across industrial and embedded markets.
Built on the Cyclone III device family architecture, this device targets applications that require substantial on-chip logic and memory, flexible I/O, and operation across a wide temperature range while maintaining low supply-voltage operation.
Key Features
- Logic Capacity — Provides 119,088 logic elements for complex digital designs and high-density integration.
- Embedded Memory — Approximately 3.98 Mbits of on-chip RAM to support buffering, data manipulation, and state storage without external memory.
- I/O Resources — 283 user I/O pins to support a broad set of peripheral interfaces and high pin-count system integration.
- Low-Voltage Supply — Core supply range of 1.15 V to 1.25 V to support low-power system architectures.
- Industrial Temperature Range — Rated for operation from –40°C to 100°C, suitable for thermally-challenged and industrial environments.
- Package and Mounting — 484-BGA (484-FBGA, 23×23) surface-mount package for compact board-level integration.
- Low-Power Family Attributes — Cyclone III family features are oriented toward low power consumption, enabling extended battery life and reduced cooling needs in system designs.
- Clock Management — Cyclone III family devices include multiple PLLs for robust clocking and system timing (family-level feature).
- Regulatory Compliance — RoHS-compliant construction to meet common environmental requirements.
Typical Applications
- Portable and Handheld Devices — Low-power Cyclone III family characteristics and the device’s core supply range help extend battery life and reduce thermal load in portable systems.
- Industrial Control and Automation — Industrial-grade temperature rating (–40°C to 100°C) and extensive I/O make the device suitable for sensor interfacing, motor control, and real-time logic tasks.
- High-Density Embedded Systems — Large logic capacity and embedded memory enable integration of complex state machines, protocol handling, and local data processing to reduce external BOM.
- I/O-Intensive Interfaces — High I/O count supports bridging, custom interfaces, and board-level protocol integration where many signals or peripherals are required.
Unique Advantages
- High Logic Density: 119,088 logic elements support complex designs and allow consolidation of multiple functions into a single FPGA to simplify system architecture.
- Significant On-Chip Memory: Approximately 3.98 Mbits of embedded RAM reduces dependency on external memory, improving board-level reliability and reducing latency.
- Broad I/O Capability: 283 user I/Os provide flexible connectivity for diverse peripherals and high pin-count system requirements.
- Industrial Reliability: Rated operation from –40°C to 100°C and RoHS compliance make the device suitable for demanding deployment conditions.
- Compact Package: 484-FBGA (23×23) surface-mount package enables high-density PCB designs while maintaining manufacturability.
- Low-Voltage Operation: Narrow core voltage range (1.15 V–1.25 V) aligns with low-power system designs and helps reduce overall power consumption.
Why Choose EP3C120F484I7?
The EP3C120F484I7 combines substantial logic capacity and embedded memory with a high I/O count and industrial temperature capability, positioning it for designs that demand integration, reliability, and low-power operation. It is a practical option for engineers consolidating functionality, reducing external components, and targeting thermally-challenged environments.
This device is well suited to product lines where scalability, reduced BOM, and long-term availability are priorities—especially in industrial and embedded applications that leverage the Cyclone III family’s low-power and clock-management features.
Request a quote or submit an inquiry to obtain pricing and availability for the EP3C120F484I7 and to discuss how it can fit into your next design.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018