EP3C120F484I7

IC FPGA 283 I/O 484FBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 283 3981312 119088 484-BGA

Quantity 77 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O283Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7443Number of Logic Elements/Cells119088
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3981312

Overview of EP3C120F484I7 – Cyclone® III FPGA, 119,088 logic elements, 484-BGA

The EP3C120F484I7 is an Intel Cyclone® III Field Programmable Gate Array (FPGA) provided in a 484-ball BGA package for surface-mount applications. It delivers a large logic capacity and embedded memory suited to high-volume, low-power, cost-sensitive designs across industrial and embedded markets.

Built on the Cyclone III device family architecture, this device targets applications that require substantial on-chip logic and memory, flexible I/O, and operation across a wide temperature range while maintaining low supply-voltage operation.

Key Features

  • Logic Capacity — Provides 119,088 logic elements for complex digital designs and high-density integration.
  • Embedded Memory — Approximately 3.98 Mbits of on-chip RAM to support buffering, data manipulation, and state storage without external memory.
  • I/O Resources — 283 user I/O pins to support a broad set of peripheral interfaces and high pin-count system integration.
  • Low-Voltage Supply — Core supply range of 1.15 V to 1.25 V to support low-power system architectures.
  • Industrial Temperature Range — Rated for operation from –40°C to 100°C, suitable for thermally-challenged and industrial environments.
  • Package and Mounting — 484-BGA (484-FBGA, 23×23) surface-mount package for compact board-level integration.
  • Low-Power Family Attributes — Cyclone III family features are oriented toward low power consumption, enabling extended battery life and reduced cooling needs in system designs.
  • Clock Management — Cyclone III family devices include multiple PLLs for robust clocking and system timing (family-level feature).
  • Regulatory Compliance — RoHS-compliant construction to meet common environmental requirements.

Typical Applications

  • Portable and Handheld Devices — Low-power Cyclone III family characteristics and the device’s core supply range help extend battery life and reduce thermal load in portable systems.
  • Industrial Control and Automation — Industrial-grade temperature rating (–40°C to 100°C) and extensive I/O make the device suitable for sensor interfacing, motor control, and real-time logic tasks.
  • High-Density Embedded Systems — Large logic capacity and embedded memory enable integration of complex state machines, protocol handling, and local data processing to reduce external BOM.
  • I/O-Intensive Interfaces — High I/O count supports bridging, custom interfaces, and board-level protocol integration where many signals or peripherals are required.

Unique Advantages

  • High Logic Density: 119,088 logic elements support complex designs and allow consolidation of multiple functions into a single FPGA to simplify system architecture.
  • Significant On-Chip Memory: Approximately 3.98 Mbits of embedded RAM reduces dependency on external memory, improving board-level reliability and reducing latency.
  • Broad I/O Capability: 283 user I/Os provide flexible connectivity for diverse peripherals and high pin-count system requirements.
  • Industrial Reliability: Rated operation from –40°C to 100°C and RoHS compliance make the device suitable for demanding deployment conditions.
  • Compact Package: 484-FBGA (23×23) surface-mount package enables high-density PCB designs while maintaining manufacturability.
  • Low-Voltage Operation: Narrow core voltage range (1.15 V–1.25 V) aligns with low-power system designs and helps reduce overall power consumption.

Why Choose EP3C120F484I7?

The EP3C120F484I7 combines substantial logic capacity and embedded memory with a high I/O count and industrial temperature capability, positioning it for designs that demand integration, reliability, and low-power operation. It is a practical option for engineers consolidating functionality, reducing external components, and targeting thermally-challenged environments.

This device is well suited to product lines where scalability, reduced BOM, and long-term availability are priorities—especially in industrial and embedded applications that leverage the Cyclone III family’s low-power and clock-management features.

Request a quote or submit an inquiry to obtain pricing and availability for the EP3C120F484I7 and to discuss how it can fit into your next design.

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