EP3C120F484I7N

The EP3C120F484I7N is a Cyclone® III family FPGA delivering substantial logic capacity and embedded memory in a compact 484-BGA surface-mount package. Built on the Cyclone III device family, it targets high-volume, low-power and cost-sensitive designs where integration and efficient power use are important.

This industrial-grade device provides 119,088 logic elements, approximately 3.98 Mbits of embedded memory and 283 user I/O pins, combined with a low core-voltage operating window (1.15 V to 1.25 V) and an operating temperature range of −40 °C to 100 °C for robust system-level deployment.

Key Features

• Logic Capacity — 119,088 logic elements for complex custom logic and control functions.
• Embedded Memory — approximately 3.98 Mbits of on-chip RAM for buffering, lookup tables and local storage.
• I/O Resources — 283 user I/Os to interface with peripherals, sensors and external buses.
• Core Voltage — specified supply range of 1.15 V to 1.25 V for the device core.
• Industrial Temperature Rating — rated for −40 °C to 100 °C to meet industrial environmental requirements.
• Package & Mounting — 484-FBGA (23×23) / 484-BGA surface-mount package for compact PCB designs.
• Family Low-Power Design — Cyclone III family devices are based on a TSMC low-power process and silicon/software optimizations to minimize power consumption.
• Clock Management (family) — Cyclone III devices include four phase-locked loops (PLLs) per device for clock synthesis and flexible timing architectures.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Portable and handheld devices — family-level low-power design helps extend battery life in portable and thermally constrained products.
• Industrial control and automation — industrial temperature rating and high I/O count support sensor interfacing, motor control and factory automation tasks.
• Embedded processing and custom logic — large logic and memory resources accommodate custom accelerators, protocol handling and integration of soft processors available in the Cyclone III family.
• Communications and timing-sensitive systems — multiple PLLs and abundant I/O simplify clocking and interface design for communications endpoints and system endpoints.

Unique Advantages

• Highly integrated logic and memory: 119,088 logic elements and ~3.98 Mbits of embedded RAM reduce reliance on external components and simplify board design.
• Low-voltage core operation: 1.15–1.25 V supply range helps lower overall power consumption in system designs.
• Industrial temperature capability: −40 °C to 100 °C rating enables reliable operation across demanding field environments.
• High I/O density: 283 user I/Os allow flexible interfacing with sensors, ADCs/DACs, memory and high-speed peripherals.
• Compact BGA footprint: 484-FBGA (23×23) surface-mount package supports dense PCB layouts while maintaining thermal and routing performance.
• Compliant and production-ready: RoHS compliance supports environmental requirements for production volumes.

Why Choose EP3C120F484I7N?

The EP3C120F484I7N positions itself as a high-capacity, industrial-grade Cyclone III FPGA suitable for designs that require substantial programmable logic, on-chip memory and a large number of I/Os in a compact surface-mount package. Its low-voltage core and family-level low-power characteristics make it a practical choice for power-conscious systems, while the device’s thermal range and RoHS compliance support deployment in industrial and production environments.

Designers seeking a scalable FPGA platform with strong integration potential and flexible clocking options will find this device aligns well with embedded processing, control and interface consolidation objectives, backed by the Cyclone III device family feature set.

Request a quote or submit a request for pricing and availability to move your design forward with EP3C120F484I7N.