EP3C120F780C7N
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 531 3981312 119088 780-BGA |
|---|---|
| Quantity | 50 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BGA | Number of I/O | 531 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7443 | Number of Logic Elements/Cells | 119088 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3981312 |
Overview of EP3C120F780C7N – Cyclone® III Field Programmable Gate Array (780-FBGA)
The EP3C120F780C7N is a Cyclone® III family FPGA provided in a 780-ball FBGA package. It delivers a high-density logic fabric with 119,088 logic elements and approximately 3.98 Mbits of embedded memory, making it suitable for complex, cost-sensitive designs.
As a member of the Cyclone III device family, this device targets low-power, high-functionality applications and supports extensive I/O and system-integration features. Key electrical and environmental parameters include a core supply range of 1.15 V to 1.25 V and a commercial operating temperature range of 0 °C to 85 °C.
Key Features
- Logic Capacity 119,088 logic elements provide substantial programmable fabric for combinational and sequential logic.
- Configurable Logic Blocks (CLBs) 7,443 CLBs for implementing structured logic and designers’ custom functions.
- Embedded Memory Approximately 3.98 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage.
- I/O Density and Flexibility 531 user I/Os for broad external connectivity; supports a wide range of I/O standards listed in the Cyclone III family documentation.
- Power and Voltage Core supply voltage range of 1.15 V to 1.25 V consistent with Cyclone III low-power silicon and design flows.
- Clocking and Timing Cyclone III family devices include multiple PLLs for robust clock management; family-level documentation notes four PLLs per device with multiple outputs and dynamic reconfiguration capabilities.
- Package and Mounting 780-ball FBGA package (29 × 29); surface mount package case specified as 780-BGA.
- Operating Range Commercial grade operation from 0 °C to 85 °C.
- Compliance RoHS compliant.
Typical Applications
- High-volume, cost-sensitive products Leverages Cyclone III’s low-power, low-cost focus to meet production and BOM targets for large-scale deployments.
- Portable and handheld devices Low-power family characteristics help extend battery life and enable operation in thermally constrained designs.
- Embedded systems and custom processing On-chip RAM and support for Nios® II and pre-built IP cores (Cyclone III family) allow designers to implement custom embedded functions and offload system tasks.
- I/O-intensive interfaces High I/O count and support for multiple I/O standards suit applications that require dense external connectivity and flexible signaling.
Unique Advantages
- High-density programmable fabric: 119,088 logic elements enable implementation of large and complex designs on a single device, reducing board-level component count.
- Significant embedded memory: Approximately 3.98 Mbits of on-chip RAM supports local buffering and memory-centric functions without immediate need for external RAM.
- Extensive I/O and standards support: 531 user I/Os and family-level support for a wide range of I/O standards provide flexibility for diverse interface requirements.
- Low-power family characteristics: Cyclone III family optimizations and TSMC low-power process technology are targeted at reducing static power for power-sensitive designs.
- Integrated clock management: Multiple PLLs per device and dynamic reconfiguration capabilities simplify clock distribution and timing control across subsystems.
- Proven IP ecosystem: Availability of pre-built and verified IP cores and support for Nios® II embedded processor (family-level) helps accelerate development and reduce time-to-market.
Why Choose EP3C120F780C7N?
The EP3C120F780C7N combines high logic density, substantial embedded memory, and a large number of I/Os in a commercial-grade Cyclone III FPGA package. It is positioned for designs that require a balance of performance, integration, and low power—particularly high-volume and cost-sensitive products as well as portable applications where reduced power draw matters.
Choosing this device provides access to Cyclone III family-level features such as robust clock management, a broad IP ecosystem, and flexible I/O standard support, helping teams build scalable, integrated systems while leveraging existing development flows and tools.
Request a quote or submit an inquiry for pricing and availability of EP3C120F780C7N. Our team can provide lead-time and ordering information to support your design schedule.

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