EP3C120F780C7N

IC FPGA 531 I/O 780FBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 531 3981312 119088 780-BGA

Quantity 50 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BGANumber of I/O531Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7443Number of Logic Elements/Cells119088
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3981312

Overview of EP3C120F780C7N – Cyclone® III Field Programmable Gate Array (780-FBGA)

The EP3C120F780C7N is a Cyclone® III family FPGA provided in a 780-ball FBGA package. It delivers a high-density logic fabric with 119,088 logic elements and approximately 3.98 Mbits of embedded memory, making it suitable for complex, cost-sensitive designs.

As a member of the Cyclone III device family, this device targets low-power, high-functionality applications and supports extensive I/O and system-integration features. Key electrical and environmental parameters include a core supply range of 1.15 V to 1.25 V and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

  • Logic Capacity  119,088 logic elements provide substantial programmable fabric for combinational and sequential logic.
  • Configurable Logic Blocks (CLBs)  7,443 CLBs for implementing structured logic and designers’ custom functions.
  • Embedded Memory  Approximately 3.98 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage.
  • I/O Density and Flexibility  531 user I/Os for broad external connectivity; supports a wide range of I/O standards listed in the Cyclone III family documentation.
  • Power and Voltage  Core supply voltage range of 1.15 V to 1.25 V consistent with Cyclone III low-power silicon and design flows.
  • Clocking and Timing  Cyclone III family devices include multiple PLLs for robust clock management; family-level documentation notes four PLLs per device with multiple outputs and dynamic reconfiguration capabilities.
  • Package and Mounting  780-ball FBGA package (29 × 29); surface mount package case specified as 780-BGA.
  • Operating Range  Commercial grade operation from 0 °C to 85 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • High-volume, cost-sensitive products  Leverages Cyclone III’s low-power, low-cost focus to meet production and BOM targets for large-scale deployments.
  • Portable and handheld devices  Low-power family characteristics help extend battery life and enable operation in thermally constrained designs.
  • Embedded systems and custom processing  On-chip RAM and support for Nios® II and pre-built IP cores (Cyclone III family) allow designers to implement custom embedded functions and offload system tasks.
  • I/O-intensive interfaces  High I/O count and support for multiple I/O standards suit applications that require dense external connectivity and flexible signaling.

Unique Advantages

  • High-density programmable fabric: 119,088 logic elements enable implementation of large and complex designs on a single device, reducing board-level component count.
  • Significant embedded memory: Approximately 3.98 Mbits of on-chip RAM supports local buffering and memory-centric functions without immediate need for external RAM.
  • Extensive I/O and standards support: 531 user I/Os and family-level support for a wide range of I/O standards provide flexibility for diverse interface requirements.
  • Low-power family characteristics: Cyclone III family optimizations and TSMC low-power process technology are targeted at reducing static power for power-sensitive designs.
  • Integrated clock management: Multiple PLLs per device and dynamic reconfiguration capabilities simplify clock distribution and timing control across subsystems.
  • Proven IP ecosystem: Availability of pre-built and verified IP cores and support for Nios® II embedded processor (family-level) helps accelerate development and reduce time-to-market.

Why Choose EP3C120F780C7N?

The EP3C120F780C7N combines high logic density, substantial embedded memory, and a large number of I/Os in a commercial-grade Cyclone III FPGA package. It is positioned for designs that require a balance of performance, integration, and low power—particularly high-volume and cost-sensitive products as well as portable applications where reduced power draw matters.

Choosing this device provides access to Cyclone III family-level features such as robust clock management, a broad IP ecosystem, and flexible I/O standard support, helping teams build scalable, integrated systems while leveraging existing development flows and tools.

Request a quote or submit an inquiry for pricing and availability of EP3C120F780C7N. Our team can provide lead-time and ordering information to support your design schedule.

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