EP3C120F484C8

The EP3C120F484C8 is a Cyclone III family FPGA delivering a balance of integration, low-power operation, and programmable logic density for cost- and power-sensitive applications. Built on the Cyclone III architecture, it targets designs that need significant on-chip logic, memory, and I/O capacity in a 484-ball FBGA package.

This device is suited for high-volume embedded systems, portable and thermally-constrained products, and applications requiring flexible I/O and clock management while operating within commercial temperature and supply-voltage ranges.

Key Features

• Logic Capacity  119,088 logic elements provide substantial programmable logic resource for complex glue logic, state machines, and custom functions.
• Embedded Memory  Approximately 3.98 Mbits of on-chip RAM for FIFOs, buffering, and small data storage without external memory.
• I/O Density  283 user I/O pins to support multiple interfaces, signal routing, and peripheral connectivity in compact system designs.
• Clock Management  Family-level support includes four phase-locked loops (PLLs) per device with five outputs per PLL for flexible clock synthesis and distribution.
• Low-Power Process  Based on TSMC low-power (LP) process technology and Cyclone III family optimizations to minimize static power consumption for battery-powered or thermally-challenged applications.
• Power Supply  Core supply specified at 1.15 V to 1.25 V, enabling predictable power design and supply planning.
• Package  484-ball FBGA (23 × 23 matrix) package for high pin-count routing in a compact footprint; package case listed as 484-BGA.
• Commercial Grade  Operating temperature range 0 °C to 85 °C suitable for standard commercial applications.
• Standards & Integration  Cyclone III family supports a wide range of I/O standards and on-chip integration features (as documented for the family) to help simplify board-level design.
• RoHS Compliant  Manufactured to meet RoHS requirements.

Typical Applications

• Portable and Handheld Devices  Low static power characteristics make this FPGA suitable for battery-powered equipment where extending battery life is important.
• Embedded Control and Glue Logic  High logic element count and abundant I/O enable consolidation of glue logic, protocol bridging, and custom control fabrics.
• High-Density I/O Systems  283 user I/Os support multi-channel interfaces, sensor arrays, and peripheral-rich designs requiring significant external connectivity.
• Clock-Dependent Designs  On-chip PLLs support robust clock management for data interfaces, clock domain crossing, and timing-critical subsystems.

Unique Advantages

• Significant Logic Resource: 119,088 logic elements allow implementation of complex finite-state machines, datapaths, and custom accelerators without immediate need for ASIC development.
• On-Chip Memory: Approximately 3.98 Mbits of embedded RAM reduce dependence on external memory for buffering and small data stores, simplifying BOM and PCB layout.
• High I/O Count in a Compact Package: The 484-FBGA (23×23) package delivers extensive I/O in a space-efficient footprint, aiding high-density board designs.
• Predictable Power Envelope: Operation on a defined 1.15 V–1.25 V core supply and low-power process technology helps with power-budgeting and thermal planning.
• Commercial Temperature Range: Rated 0 °C to 85 °C for mainstream electronic products and systems with standard environmental requirements.
• Family-Level Tooling and IP: As part of the Cyclone III family, the device benefits from documented family features such as clocking resources and a library of verified IP cores to accelerate integration.

Why Choose EP3C120F484C8?

The EP3C120F484C8 delivers a pragmatic combination of programmable logic density, embedded memory, and substantial I/O capacity in a RoHS-compliant 484-FBGA package. Its low-power heritage and well-documented Cyclone III family capabilities make it a strong candidate for designers building cost- and power-conscious embedded systems that require reliable, scalable programmable logic.

This device is suited for engineering teams who need to reduce board-level components, manage power and thermal budgets, and leverage family-level clocking and IP resources to shorten development cycles.

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