EP3C120F484C7

The EP3C120F484C7 is a Cyclone® III field programmable gate array (FPGA) offered by Intel. It delivers a high-count programmable fabric with 119,088 logic elements and approximately 3.98 Mbits of embedded memory, making it suitable for high‑function, cost‑sensitive designs that require a balance of integration and low power.

Built in a 484‑BGA (484‑FBGA, 23×23) surface‑mount package, this commercial‑grade device provides 283 I/Os, a core supply range of 1.15 V to 1.25 V, and an operating temperature range of 0 °C to 85 °C. It is RoHS compliant and well suited to designs that prioritize integration, I/O density, and controlled power consumption.

Key Features

• Logic Capacity  119,088 programmable logic elements for implementing complex digital functions and custom logic.
• Embedded Memory  Approximately 3.98 Mbits of on‑chip RAM to support buffering, frame storage, and stateful logic without external memory.
• I/O Density  283 general‑purpose I/O pins to support dense peripheral, sensor, and interface connectivity from a single device.
• Package & Mounting  484‑BGA (484‑FBGA, 23×23) surface‑mount package for compact PCB integration and high pin‑count routing.
• Power Supply  Core voltage range of 1.15 V to 1.25 V to match standard Cyclone III power rails and enable predictable power planning.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for mainstream commercial applications.
• Low‑Power Cyclone III Family Characteristics  Part of the Cyclone III device family, which emphasizes low power consumption through TSMC low‑power process technology and power‑aware design features.
• Clock Management  Cyclone III devices provide robust clocking resources (family documentation describes multi‑phase PLLs and dynamic reconfiguration for flexible clock synthesis and distribution).
• Regulatory Compliance  RoHS compliant to support modern manufacturing and environmental requirements.

Typical Applications

• Embedded Systems  Custom processing, glue logic, and soft‑processor implementations that benefit from large logic capacity and on‑chip memory.
• Communications & Networking  I/O‑dense designs requiring multiple interfaces, protocol bridging, and flexible logic for packet processing or control planes.
• Consumer & Portable Electronics  Cost‑sensitive, low‑power products that need high integration and a compact BGA package.
• Prototyping & Development  Complex system prototyping where substantial logic resources and embedded memory allow accurate hardware validation before production.

Unique Advantages

• High logic and memory integration: Combines 119,088 logic elements with approximately 3.98 Mbits of embedded RAM to reduce external components and simplify board design.
• Dense I/O in a compact package: 283 I/Os in a 484‑BGA (23×23) footprint enables rich peripheral connectivity while conserving PCB area.
• Designed for low power: As part of the Cyclone III family, the device benefits from low‑power process technology and power‑aware design features that help meet power budgets in battery‑ or thermally‑constrained systems.
• Commercial temperature support: Specified 0 °C to 85 °C operation for mainstream commercial applications and environments.
• RoHS compliant: Meets common environmental manufacturability requirements for modern electronics production.

Why Choose EP3C120F484C7?

The EP3C120F484C7 positions itself as a high‑capacity Cyclone III FPGA option when large programmable logic and on‑chip memory are required in a single, compact package. Its combination of 119,088 logic elements, substantial embedded RAM, and 283 I/Os makes it a compelling choice for design teams targeting integration, flexible interfaces, and controlled power consumption in commercial applications.

Backed by the Cyclone III family characteristics—low power, integrated clock management, and a broad feature set—this device is suitable for customers developing cost‑sensitive, high‑volume products or complex prototypes that demand substantial programmable resources without sacrificing board space.

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