EP3C16E144C7N

The EP3C16E144C7N is a Cyclone® III Field Programmable Gate Array (FPGA) IC designed for low-power, cost-sensitive designs that require moderate logic capacity and flexible I/O. Based on the Cyclone III device family, it delivers a balance of functionality, on-chip memory, and system integration features suitable for high-volume and battery-conscious products.

This device targets applications that need configurable logic, embedded memory, and a compact surface-mount package while operating within a commercial temperature range and a 1.15 V to 1.25 V core supply window.

Key Features

• Logic Capacity  Provides 15,408 logic elements to implement medium-complexity digital functions and custom logic blocks.
• Embedded Memory  Approximately 0.52 Mbits of on-chip RAM to support buffering, state storage, and small data tables without external memory.
• I/O Count and Flexibility  84 user I/Os to support multiple interfaces and peripheral connections in I/O-rich designs.
• Low-Power Device Family  Built on Cyclone III family technology that emphasizes low power and cost efficiency for high-volume and portable applications.
• Package and Mounting  144-LQFP exposed pad package (supplier device package: 144-EQFP, 20×20) with surface-mount mounting for compact PCB layouts and thermal conduction through the exposed pad.
• Supply and Temperature  Core voltage support from 1.15 V to 1.25 V and an operating temperature range of 0 °C to 85 °C for commercial deployments.
• Standards and Integration  Cyclone III family supports a wide collection of I/O standards and system integration features such as PLLs and on-chip peripherals (as described in Cyclone III device family documentation).
• Compliance  RoHS compliant for lead-free manufacturing requirements.

Typical Applications

• Portable and Handheld Devices  Low-power characteristics and compact packaging make the device suitable for battery-powered consumer products where power budget and board space matter.
• Consumer Electronics  Use for custom control logic, interfacing, and protocol bridging in mid-range consumer products requiring flexible I/O and embedded memory.
• Embedded Processing and Peripherals  Implement small custom processors, peripheral controllers, or glue logic leveraging the on-chip RAM and logic elements.
• I/O-Rich Interface Modules  Ideal for applications that require multiple I/O standards and moderate pin counts to connect sensors, displays, and external controllers.
• High-Volume, Cost-Sensitive Products  Designed for systems where low unit cost and efficient power use are key selection criteria.

Unique Advantages

• Balanced Logic and Memory:  15,408 logic elements paired with approximately 0.52 Mbits of embedded RAM provide a practical balance for mid-complexity designs without immediate need for external RAM.
• Low-Power Family Design:  Part of the Cyclone III family engineered for low power, helping extend battery life and reduce cooling requirements in thermally constrained products.
• Compact, Surface-Mount Package:  144-LQFP exposed pad (20×20 footprint) enables compact PCB integration and improved thermal performance through the exposed pad.
• Flexible I/O Count:  84 I/Os support a variety of interface requirements, reducing the need for additional IO expanders in many designs.
• Commercial Temperature Range:  Rated for 0 °C to 85 °C, matching common consumer and commercial product operating environments.
• Regulatory Compatibility:  RoHS compliance facilitates integration into lead-free manufacturing processes.

Why Choose EP3C16E144C7N?

The EP3C16E144C7N provides a pragmatic combination of configurable logic, on-chip memory, and a versatile I/O complement in a compact surface-mount package. Its Cyclone III family heritage emphasizes low power and system integration features, making it well suited for designers focused on high-volume, cost- and power-sensitive applications.

Choose this device when you need a commercially graded FPGA that offers scalable design capability, straightforward board-level integration through a 144-LQFP exposed pad package, and support from the Cyclone III device family resources for IP and system-level features.

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