EP3C16F256C6N

The EP3C16F256C6N is a Cyclone® III family FPGA optimized for low-power, cost-sensitive applications. It integrates 15,408 logic elements and approximately 0.5 Mbits of embedded memory in a compact 256-LBGA package, delivering programmable logic, on-chip memory, and rich I/O in a surface-mount form factor.

Designed for commercial-grade systems, this device targets high-volume, low-power designs where efficient integration, flexible I/O, and FPGA-based customization are priorities.

Key Features

• Logic Density — 15,408 logic elements provide programmable logic capacity for mid-range application designs.
• Embedded Memory — 516,096 bits of on-chip RAM (approximately 0.5 Mbits) for data buffering, state storage, and small block storage needs.
• I/O Count & Flexibility — 168 I/O pins with support for multiple I/O standards including LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI‑X, LVPECL, BLVDS, LVDS, mini‑LVDS, RSDS, and PPDS to interface with a wide range of peripherals.
• Clock Management — Family-level clocking features include up to four phase-locked loops (PLLs) per device with multiple outputs, enabling synthesized and managed clock domains without reconfiguration.
• Low-Power Family Attributes — Based on low-power process and device-level optimizations, Cyclone III devices are positioned for reduced static power consumption in battery- and thermally-constrained designs.
• Power Supply — Core voltage operation between 1.15 V and 1.25 V, enabling compatibility with low-voltage system rails.
• Package & Mounting — 256-LBGA package (supplier device package: 256-FBGA, 17×17) for surface-mount PCB assembly and compact board layouts.
• Commercial Temperature Range — Rated for 0 °C to 85 °C operating temperature for commercial applications.
• Standards & Compliance — RoHS compliant for environmental and manufacturing considerations.

Typical Applications

• Portable and Handheld Systems — Low-power family attributes make this FPGA suitable for battery-powered products requiring programmable logic and on-chip memory.
• Consumer and High-Volume Electronics — Mid-range logic density and compact LBGA package support cost-sensitive, space-constrained consumer designs.
• Interface Bridging and Protocol Handling — Rich I/O and support for multiple signaling standards enable protocol translation, custom interfaces, and peripheral aggregation.
• Embedded Control and Signal Processing — On-chip RAM and programmable logic enable real-time control tasks, buffering, and custom datapath implementations.

Unique Advantages

• Balanced Integration: Combines 15,408 logic elements with embedded memory and multi-standard I/O to reduce external components and simplify BOM.
• Flexible I/O Support: Broad I/O standard compatibility enables direct interfacing to a wide range of peripherals and legacy interfaces.
• Compact Packaging: 256-LBGA (256-FBGA, 17×17) delivers a small PCB footprint for dense board designs.
• Low-Voltage Operation: Core supply range of 1.15 V to 1.25 V aligns with modern low-voltage system architectures to help reduce power consumption.
• Commercial Reliability: Rated for 0 °C to 85 °C operation and RoHS compliance for mainstream commercial product manufacturing.
• Family-Level Clocking Features: Multiple PLLs and configurable outputs provide robust clocking and timing management without external clocking complexity.

Why Choose EP3C16F256C6N?

The EP3C16F256C6N positions Cyclone III FPGA capabilities into a compact, commercial-grade device that balances programmable logic capacity, embedded memory, and flexible I/O within a low-voltage, low-power platform. It is well suited to designers seeking mid-range FPGA resources for cost-sensitive, space-constrained, or power-aware systems.

Choosing this device delivers a programmable building block supported by Cyclone III family features—enabling designers to consolidate functionality, adapt to changing requirements, and leverage on-chip clocking and memory for cleaner, more integrated system designs.

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