EP3C16F256C6

The EP3C16F256C6 is a Cyclone® III field-programmable gate array (FPGA) in a 256‑LBGA package, offered as a commercial‑grade, surface‑mount device. It delivers 15,408 logic elements, approximately 0.5 Mbits of embedded memory (516,096 bits), and 168 general‑purpose I/Os for mid‑range programmable logic designs.

As part of the Cyclone III device family, this FPGA targets high‑volume, cost‑sensitive applications where low power, flexible I/O, and on‑chip memory/logic integration are key design drivers.

Key Features

• Logic Capacity — 15,408 logic elements suitable for mid‑range combinational and sequential logic implementations.
• Embedded Memory — Approximately 0.5 Mbits of on‑chip RAM (516,096 bits) for buffering, FIFOs, and small data storage.
• I/O Density — 168 I/O pins to support multiple interfaces and external peripherals in compact designs.
• Power Supply — Operates from a 1.15 V to 1.25 V core supply range, aligning with low‑voltage system designs.
• Package & Mounting — 256‑LBGA package; supplier device package listed as 256‑FBGA (17×17); surface mount for PCB assembly.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Family‑Level Capabilities — Benefits from Cyclone III family characteristics such as low‑power process technology, support for multiple I/O standards, and device clock management features (family documentation describes PLLs and reconfiguration capabilities).
• Compliance — RoHS‑compliant.

Typical Applications

• Consumer & Commercial Electronics — Implement custom control, signal processing, and user‑interface logic where low power and compact packaging matter.
• Embedded Systems & Prototyping — Mid‑range FPGA capacity for evaluating custom logic, peripherals integration, and system validation.
• Communications & Networking — I/O‑rich designs requiring interface bridging, protocol logic, or peripheral aggregation.
• Low‑power, High‑volume Products — Designs where a balance of functionality and cost efficiency is required for mass production.

Unique Advantages

• Balanced Logic and Memory: 15,408 logic elements paired with approximately 0.5 Mbits of embedded memory enables compact implementations of control and data‑path functions on a single device.
• High I/O Count: 168 I/Os provide flexibility for interfacing multiple peripherals and external devices without external glue logic.
• Low‑Voltage Operation: Narrow core supply range (1.15 V–1.25 V) supports modern low‑power system architectures.
• Compact BGA Packaging: 256‑LBGA / 256‑FBGA (17×17) footprint helps minimize PCB area while maintaining signal density.
• Commercial Temperature Suitability: Designed for 0 °C to 85 °C operation to meet typical commercial product requirements.
• Proven Family Ecosystem: Part of the Cyclone III family with documented low‑power design practices and available pre‑built IP to accelerate development.

Why Choose EP3C16F256C6?

The EP3C16F256C6 provides a practical mid‑range FPGA option for designers who need a combination of logic capacity, on‑chip memory, and a high I/O count in a compact, surface‑mount package. Its commercial temperature rating and RoHS compliance make it suitable for consumer and commercial systems where cost, power, and PCB real estate are important considerations.

Being part of the Cyclone III family allows you to leverage the family’s low‑power design focus and the broader ecosystem of device documentation and IP to shorten development time and reduce system BOM complexity.

Request a quote or submit an inquiry to receive pricing and availability information for EP3C16F256C6.