EP3C16F256I7

The EP3C16F256I7 is a Cyclone III family FPGA in a 256-LBGA package designed for cost- and power-sensitive embedded designs. It provides a mid-range FPGA fabric with 15,408 logic elements, approximately 0.52 Mbits of embedded memory, and 168 user I/O, making it suitable for applications that require a balanced mix of logic density, on-chip memory, and I/O connectivity.

Based on the Cyclone III device family, this device leverages low-power process technology and family-level features aimed at reducing power consumption and simplifying system integration in portable, thermally-challenged, and high-volume designs.

Key Features

• Logic Capacity — 15,408 logic elements for implementing medium-complexity logic, control, and glue-logic functions.
• Embedded Memory — Total on-chip RAM of 516,096 bits (approximately 0.52 Mbits) to support FIFOs, buffering, and small data stores without external memory.
• I/O Count & Flexibility — 168 user I/O pins, supporting a range of interface needs for sensors, peripherals, and board-level interconnect.
• Clock Management — Cyclone III family architecture includes multiple phase-locked loops (PLLs) for clock synthesis and management to support varied timing domains and interface clocks.
• Power Supply Range — Core supply in the range of 1.15 V to 1.25 V to match system power rails and power-management strategies.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial and thermally-challenged environments.
• Package & Mounting — 256-LBGA surface-mount package; supplier device package listed as 256-FBGA (17 × 17).
• Low-Power Family Characteristics — Cyclone III family features low-power TSMC process optimizations and power-aware design flow to reduce static and dynamic power consumption.
• RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly processes.

Typical Applications

• Portable and Handheld Devices — Low-power family characteristics and compact BGA packaging enable battery-conscious designs and space-constrained boards.
• Industrial Control and Instrumentation — Industrial temperature rating and flexible I/O make the device suitable for sensor interfacing, motor-control logic, and real-time I/O aggregation.
• Embedded Systems and Prototyping — On-chip RAM and logic capacity support custom control logic, peripheral glue, and simple embedded processing tasks.
• Communications and Interface Bridging — High I/O count and family-level support for diverse I/O standards allow use as protocol translators, bus bridges, and I/O concentrators.

Unique Advantages

• Balanced Logic and Memory: 15,408 logic elements paired with ~0.52 Mbits of embedded memory provide a compact, mid-range platform for control and buffering without immediate need for external SRAM.
• Broad I/O Connectivity: 168 I/O pins give designers flexibility to connect multiple peripherals, sensors, and external interfaces while minimizing external glue logic.
• Industrial Thermal Range: −40 °C to 100 °C rating supports reliable operation in industrial and rugged environments.
• Low-Power Architecture: Cyclone III family optimizations reduce static and dynamic power, helping systems meet tight power budgets and extend battery life.
• System Integration Features: Family-level PLLs, on-chip memory, and support for pre-built IP cores enable efficient clock management and faster integration of standard functions.
• Compact, Surface-Mount Packaging: 256-LBGA (supplier package 256-FBGA, 17×17) provides a high-density footprint suited to modern PCB layouts.

Why Choose EP3C16F256I7?

The EP3C16F256I7 combines a mid-range FPGA fabric with sufficient on-chip memory and a high I/O count in a compact industrial-grade package. It is positioned for designs where power efficiency, reliable operation across a wide temperature range, and flexible interfacing are primary concerns. The Cyclone III family attributes—low-power process optimizations, PLL-based clock management, and available pre-verified IP—help accelerate development while keeping system power and BOM under control.

This device is well suited for engineers and procurement teams targeting industrial control, embedded systems, and portable applications that require a proven FPGA family with a good balance of logic, memory, and I/O in a surface-mount BGA package.

Please request a quote or submit your procurement inquiry to obtain pricing, availability, and lead-time details for EP3C16F256I7. Representatives will provide the next steps for evaluation units and volume purchasing.