EP3C16F484C6

The EP3C16F484C6 is an Intel Cyclone® III family field-programmable gate array (FPGA) supplied in a 484-ball BGA (484-FBGA, 23×23) surface-mount package. It delivers 15,408 logic elements and approximately 0.5 Mbits of embedded memory, together with 346 user I/O pins, making it suitable for mid-range programmable logic needs in commercial-grade applications.

Built on the Cyclone III device family architecture, the part targets low-power, cost-sensitive designs that require flexible I/O, on-chip memory, and scalable logic capacity while operating from a core supply of 1.15 V to 1.25 V and across a 0 °C to 85 °C commercial temperature range.

Key Features

• Logic Capacity — 15,408 logic elements to implement medium-density programmable logic and control functions.
• On‑Chip Memory — Approximately 0.5 Mbits of embedded RAM for FIFOs, buffering, and small-data storage.
• I/O Density — 346 user I/O pins to support multiple interfaces and board-level connectivity.
• Power Supply — Core supply range of 1.15 V to 1.25 V for system-level power planning.
• Package and Mounting — 484-ball FBGA (23×23) surface-mount package for compact board integration.
• Commercial Temperature Grade — Specified for operation from 0 °C to 85 °C for general-purpose applications.
• RoHS Compliant — Conforms to RoHS requirements for lead-free assembly and environmental compliance.
• Cyclone III Family Architecture — Built on a low-power TSMC LP process and Cyclone III device family features (including family-level clock-management and integration capabilities) to support power-sensitive designs.

Typical Applications

• Portable and Handheld Systems — Low-power family architecture and compact FBGA packaging suit battery-powered and space-constrained designs.
• Embedded Control and Processing — Logic and on-chip RAM capacity support custom control, protocol handling, and small embedded processing tasks.
• I/O-Intensive Interfaces — High I/O count enables bridging, interface conversion, and multi-bus connectivity on a single device.
• Consumer and Commercial Electronics — Commercial temperature rating and RoHS compliance align with consumer and general commercial product requirements.

Unique Advantages

• Balanced Logic and Memory: 15,408 logic elements paired with roughly 0.5 Mbits of RAM provide a compact, versatile fabric for mid-range designs.
• High I/O Count: 346 I/Os allow integration of several peripherals and external interfaces without additional glue logic.
• Compact, Board-Friendly Package: 484-FBGA (23×23) surface-mount package reduces PCB area while supporting reliable assembly.
• Low‑Power Family Heritage: Leverages Cyclone III family optimizations for low static power, helpful for thermally-challenged and battery-operated products.
• Commercial Availability: Intel manufacturing and RoHS compliance support predictable sourcing and regulatory alignment for commercial products.

Why Choose EP3C16F484C6?

The EP3C16F484C6 positions itself as a practical mid-density Cyclone III FPGA option for designers who need a combination of programmable logic, embedded memory, and a high I/O count in a compact BGA package. Its commercial temperature rating, RoHS compliance, and defined supply-voltage window make it straightforward to integrate into cost-sensitive, low-power systems.

This device is well suited to customers building portable electronics, embedded controllers, and I/O-centric applications that benefit from the Cyclone III family’s low-power architecture and system-level integration features.

For pricing, availability, or to request a quote for EP3C16F484C6, submit a quote request or contact sales through your usual procurement channel.